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Details for article 25 of 26 found articles
| Title: |
Thermal Parameters, Microstructure, and Mechanical Properties of Directionally Solidified Sn-0.7 wt.%Cu Solder Alloys Containing 0 ppm to 1000 ppm Ni |
| Author: |
Silva, Bismarck Luiz Cheung, Noé Garcia, Amauri Spinelli, José Eduardo |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 42 (2012) nr. 1 pages 179-191 |
| Year: |
2012 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 25 of 26 found articles
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