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Journal description
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Details for article 6 of 18 found articles
| Title: |
Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration |
| Author: |
Lin, Y.L. Lai, Y.S. Lin, Y.W. Kao, C.R. |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 37 (2007) nr. 1 pages 96-101 |
| Year: |
2007 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 6 of 18 found articles
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