|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 5 of 18 found articles
| Title: |
Effect of Cross-Interaction between Ni and Cu on Growth Kinetics of Intermetallic Compounds in Ni/Sn/Cu Diffusion Couples during Aging |
| Author: |
Hong, K.K. Ryu, J.B. Park, C.Y. Huh, J.Y. |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 37 (2007) nr. 1 pages 61-72 |
| Year: |
2007 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 5 of 18 found articles
| << previous | next >> |