Investigation on interfacial compound growth kinetics in Sn-0.7Cu/Cu solder joint and mechanism analysis: Experiments and molecular dynamics simulations
Titel:
Investigation on interfacial compound growth kinetics in Sn-0.7Cu/Cu solder joint and mechanism analysis: Experiments and molecular dynamics simulations
Auteur:
Ma, Tao Zhang, Shiqiang Zhang, Zhihang Zhao, Yue Shao, Wei Huang, Jihua Chen, Shuhai Ye, Zheng Wang, Wanli Yang, Jian