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Journal description
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Details for article 3 of 17 found articles
| Title: |
Dissolution kinetics of BGA Sn–Pb and Sn–Ag solders with Cu substrates during reflow |
| Author: |
Sharif, Ahmed Chan, Y.C |
| Appeared in: |
Materials science and engineering. B, Solid-state materials for advanced technology |
| Paging: | Volume 106 (2004) nr. 2 pages 6 p. |
| Year: |
2004 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 17 found articles
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