Electromigration in integrated circuit interconnects studied by X-ray microscopy
Titel:
Electromigration in integrated circuit interconnects studied by X-ray microscopy
Auteur:
Schneider, G. Denbeaux, G. Anderson, E. Bates, W. Salmassi, F. Nachimuthu, P. Pearson, A. Richardson, D. Hambach, D. Hoffmann, N. Hasse, W. Hoffmann, K.
Verschenen in:
Nuclear instruments and methods in physics research. Section B, Beam interactions with materials and atoms