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                                       Details for article 14 of 47 found articles
 
 
  Effectiveness of wafer level test for electromigration wear out reporting in advanced CMOS interconnects reliability assessment
 
 
Title: Effectiveness of wafer level test for electromigration wear out reporting in advanced CMOS interconnects reliability assessment
Author: Bana, F.
Petitprez, E.
Ney, D.
Arnaud, L.
Wouters, Y.
Appeared in: Microelectronic engineering
Paging: Volume 106 (2013) nr. C pages 5 p.
Year: 2013
Contents:
Publisher: Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 14 of 47 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands