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                                       Details for article 13 of 47 found articles
 
 
  Dependence of Cu electromigration resistance on selectively deposited CVD Co cap thickness
 
 
Title: Dependence of Cu electromigration resistance on selectively deposited CVD Co cap thickness
Author: Yang, C.-C.
Baumann, F.
Wang, P.-C.
Lee, S.Y.
Ma, P.
AuBuchon, J.
Edelstein, D.
Appeared in: Microelectronic engineering
Paging: Volume 106 (2013) nr. C pages 5 p.
Year: 2013
Contents:
Publisher: Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 13 of 47 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands