|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 115 of 187 found articles
| Title: |
Mechanical reliability evaluation of Sn-37Pb solder joint using high speed lap-shear test |
| Author: |
Jeon, Seong-jae Hyun, Seungmin Lee, Hak-Joo Kim, Jong-Woong Ha, Sang-Su Yoon, Jeong-Won Jung, Seung-Boo Lee, Hoo-Jeong |
| Appeared in: |
Microelectronic engineering |
| Paging: | Volume 85 (2008) nr. 10 pages 4 p. |
| Year: |
2008 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 115 of 187 found articles
| << previous | next >> |