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                                       Details for article 10 of 12 found articles
 
 
  Study of microstructure and resistivity evolution for electroplated copper films at near-room temperature
 
 
Title: Study of microstructure and resistivity evolution for electroplated copper films at near-room temperature
Author: Teh, W.H
Koh, L.T
Chen, S.M
Xie, J
Li, C.Y
Foo, P.D
Appeared in: Microelectronics journal
Paging: Volume 32 () nr. 7 pages 579-585
Year: 2001
Contents:
Publisher: Elsevier Science Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 10 of 12 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands