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Journal description
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Details for article 14 of 34 found articles
| Title: |
From chip to inverter: Electro-thermal modeling and design for paralleled power devices in high power application |
| Author: |
Fan, Peng Huang, Shoudao Wang, Huai Li, Huimin Luo, Derong |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 87 (2018) nr. C pages 271-277 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 14 of 34 found articles
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