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Journal description
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Details for article 13 of 34 found articles
| Title: |
Fatigue measurement setup under combined thermal and vibration loading on electronic SMT assembly |
| Author: |
Meier, Karsten Metasch, René Roellig, Mike Bock, Karlheinz |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 87 (2018) nr. C pages 125-132 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 13 of 34 found articles
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