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                                       Details for article 38 of 40 found articles
 
 
  Temperature monitoring inside IGBT modules at forward bias from the cross section and its finite element analysis
 
 
Title: Temperature monitoring inside IGBT modules at forward bias from the cross section and its finite element analysis
Author: Huang, Yongle
Luo, Yifei
Xiao, Fei
Liu, Binli
Appeared in: Microelectronics reliability
Paging: Volume 83 (2018) nr. C pages 187-197
Year: 2018
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 38 of 40 found articles
 
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