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                                       Details for article 23 of 136 found articles
 
 
  Copper Through Silicon Vias Studied by Photo-elastic Scanning Infrared Microscopy
 
 
Title: Copper Through Silicon Vias Studied by Photo-elastic Scanning Infrared Microscopy
Author: Herms, M.
Wagner, M.
De Wolf, I.
Appeared in: Microelectronics reliability
Paging: Volume 64 (2016) nr. C pages 6 p.
Year: 2016
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 23 of 136 found articles
 
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