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                                       Details for article 9 of 20 found articles
 
 
  Microstructural evolution of ultrasonic-bonded aluminum wires
 
 
Title: Microstructural evolution of ultrasonic-bonded aluminum wires
Author: Broll, Marian Sebastian
Geissler, Ute
Höfer, Jan
Schmitz, Stefan
Wittler, Olaf
Lang, Klaus Dieter
Appeared in: Microelectronics reliability
Paging: Volume 55 (2015) nr. 6 pages 8 p.
Year: 2015
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 9 of 20 found articles
 
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