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Journal description
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Details for article 8 of 20 found articles
| Title: |
Mechanical and electrical characterisation of Au wire interconnects in electronic packages under the combined vibration and thermal testing conditions |
| Author: |
Mirgkizoudi, M. Liu, C. Conway, P.P. Riches, S. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 55 (2015) nr. 6 pages 9 p. |
| Year: |
2015 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 8 of 20 found articles
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