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Journal description
All volumes of the corresponding journal
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Details for article 6 of 21 found articles
| Title: |
Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology |
| Author: |
Chang, Tao-Chih Lee, Chang-Chun Hsieh, Chia-Ping Hung, Sheng-Che Cheng, Ren-Shin |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 55 (2015) nr. 12PA pages 7 p. |
| Year: |
2015 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 6 of 21 found articles
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