nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Degradation of high power single emitter laser modules using nanosilver paste in continuous pulse conditions
|
Yan, Haidong |
|
2015 |
55 |
12PA |
p. 2532-2541 10 p. |
artikel |
2 |
Dependence of overcurrent failure modes of IGBT modules on interconnect technologies
|
Yaqub, Imran |
|
2015 |
55 |
12PA |
p. 2596-2605 10 p. |
artikel |
3 |
Design and process related MIM cap reliability improvement
|
Parke, Justin |
|
2015 |
55 |
12PA |
p. 2516-2521 6 p. |
artikel |
4 |
Editorial
|
Ersland, Peter |
|
2015 |
55 |
12PA |
p. 2483- 1 p. |
artikel |
5 |
Editorial Board
|
|
|
2015 |
55 |
12PA |
p. IFC- 1 p. |
artikel |
6 |
Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology
|
Chang, Tao-Chih |
|
2015 |
55 |
12PA |
p. 2582-2588 7 p. |
artikel |
7 |
Electromigration behavior in Cu/Ni–P/Sn–Cu based joint system with low current density
|
Kadoguchi, Takuya |
|
2015 |
55 |
12PA |
p. 2554-2559 6 p. |
artikel |
8 |
Fast atom bombardment onto vertically aligned multi-walled carbon nanotube bumps to achieve low interconnect resistance with Au layer
|
Fujino, Masahisa |
|
2015 |
55 |
12PA |
p. 2560-2564 5 p. |
artikel |
9 |
Impression creep behavior of Zn–4Al–3Mg–xSn high-temperature lead-free solders
|
Mahmudi, R. |
|
2015 |
55 |
12PA |
p. 2542-2548 7 p. |
artikel |
10 |
Improved surface morphology of a Ti/Al/Ni/Au ohmic contact for AlGaN/GaN heterostructure by Al2O3 particles
|
Lim, Jin Hong |
|
2015 |
55 |
12PA |
p. 2565-2568 4 p. |
artikel |
11 |
Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability
|
Tsai, M.Y. |
|
2015 |
55 |
12PA |
p. 2589-2595 7 p. |
artikel |
12 |
Operating channel temperature in GaN HEMTs: DC versus RF accelerated life testing
|
Pomeroy, J.W. |
|
2015 |
55 |
12PA |
p. 2505-2510 6 p. |
artikel |
13 |
Power electronics packaging
|
Suganuma, Katsuaki |
|
2015 |
55 |
12PA |
p. 2523- 1 p. |
artikel |
14 |
Preparation and thermal properties of the graphene–polyolefin adhesive composites: Application in thermal interface materials
|
Cui, Tengfei |
|
2015 |
55 |
12PA |
p. 2569-2574 6 p. |
artikel |
15 |
Scaling DC lifetests on GaN HEMT to RF conditions
|
Paine, Bruce M. |
|
2015 |
55 |
12PA |
p. 2499-2504 6 p. |
artikel |
16 |
Setting stress conditions that qualify application expectations
|
Roesch, William J. |
|
2015 |
55 |
12PA |
p. 2484-2492 9 p. |
artikel |
17 |
Study of Al−Cu compounds as soldering bond pad for high-power device packaging
|
Liu, Wei Chih |
|
2015 |
55 |
12PA |
p. 2549-2553 5 p. |
artikel |
18 |
Study of hot electrons in AlGaN/GaN HEMTs under RF Class B and Class J operation using electroluminescence
|
Brazzini, Tommaso |
|
2015 |
55 |
12PA |
p. 2493-2498 6 p. |
artikel |
19 |
Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate
|
Zhao, Su-Yan |
|
2015 |
55 |
12PA |
p. 2524-2531 8 p. |
artikel |
20 |
Temperature, humidity, and bias acceleration model for a GaAs pHEMT process
|
Drandova, Gergana I. |
|
2015 |
55 |
12PA |
p. 2511-2515 5 p. |
artikel |
21 |
Thermal characterization system for transient thermal impedance measurement and power cycling of IGBT modules
|
Zheng, Hanguang |
|
2015 |
55 |
12PA |
p. 2575-2581 7 p. |
artikel |