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Journal description
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Details for article 19 of 21 found articles
| Title: |
Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate |
| Author: |
Zhao, Su-Yan Li, Xin Mei, Yun-Hui Lu, Guo-Quan |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 55 (2015) nr. 12PA pages 8 p. |
| Year: |
2015 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 19 of 21 found articles
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