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Journal description
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Details for article 18 of 20 found articles
| Title: |
Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions |
| Author: |
Wang, Tong Hong Lai, Yi-Shao Lin, Yu-Cheng |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 48 (2008) nr. 1 pages 8 p. |
| Year: |
2008 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 18 of 20 found articles
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