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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
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Details for article 17 of 20 found articles
| Title: |
Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint |
| Author: |
Mao, Chao-Yang Chen, Rong-Sheng |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 48 (2008) nr. 1 pages 13 p. |
| Year: |
2008 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 17 of 20 found articles
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