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Journal description
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Details for article 21 of 46 found articles
| Title: |
Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept |
| Author: |
Roellig, Mike Dudek, Rainer Wiese, Steffen Boehme, Bjoern Wunderle, Berhard Wolter, Klaus-Juergen Michel, Bernd |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 47 (2007) nr. 2-3 pages 9 p. |
| Year: |
2007 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 21 of 46 found articles
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