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  Analysis of thermal stresses in metal interconnects with multilevel structures
 
 
Title: Analysis of thermal stresses in metal interconnects with multilevel structures
Author: Kilijanski, M.S.
Shen, Y.-L.
Appeared in: Microelectronics reliability
Paging: Volume 42 (2002) nr. 2 pages 6 p.
Year: 2002
Contents:
Publisher: Elsevier Science Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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