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                                       Details for article 7 of 14 found articles
 
 
  Evaluation of reliability of μBGA solder joints through twisting and bending 1 1 An earlier version of this paper was published in Proceedings of the International Symposium of Microelectronics, Philadelphia, 14–16 October, 1997[1].
 
 
Title: Evaluation of reliability of μBGA solder joints through twisting and bending 1 1 An earlier version of this paper was published in Proceedings of the International Symposium of Microelectronics, Philadelphia, 14–16 October, 1997[1].
Author: Perera, U.Daya
Appeared in: Microelectronics reliability
Paging: Volume 39 (1999) nr. 3 pages 9 p.
Year: 1999
Contents:
Publisher: Elsevier Science Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 7 of 14 found articles
 
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