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                                       Details for article 5 of 21 found articles
 
 
  A step forward in the transient thermal characterization of chips and packages
 
 
Title: A step forward in the transient thermal characterization of chips and packages
Author: Szkely, V.
Rencz, M.
Courtois, B.
Appeared in: Microelectronics reliability
Paging: Volume 39 (1999) nr. 1 pages 8 p.
Year: 1999
Contents:
Publisher: Elsevier Science Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 5 of 21 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands