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                                       Details for article 6 of 18 found articles
 
 
  Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components
 
 
Title: Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components
Author: Li, Wenqian
Wang, Xinda
Zheng, Ruiqian
Zhao, Xiaohui
Zheng, Hao
Zhao, Zhiyan
Cheng, Mengxuan
Jiang, Yong
Jia, Yuxi
Appeared in: Microelectronics reliability
Paging: Volume 163 () nr. C pages p.
Year: 2024
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 6 of 18 found articles
 
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