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Journal description
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Details for article 17 of 18 found articles
| Title: |
Thermal cycling reliability of electronic components in bolted assemblies: A study of the influence of bolt position |
| Author: |
Zhao, Shuaifeng Guo, Weiqi Wang, Shaobin Zhang, Weiwei Li, Xin |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 163 () nr. C pages p. |
| Year: |
2024 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 17 of 18 found articles
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