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Journal description
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Details for article 103 of 115 found articles
| Title: |
Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging |
| Author: |
Liu, Canyu Liu, Allan Jiang, Han Liang, Shuibao Zhou, Zhaoxia Liu, Changqing |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 138 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Published by Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 103 of 115 found articles
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