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                                       Details for article 103 of 115 found articles
 
 
  Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging
 
 
Title: Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging
Author: Liu, Canyu
Liu, Allan
Jiang, Han
Liang, Shuibao
Zhou, Zhaoxia
Liu, Changqing
Appeared in: Microelectronics reliability
Paging: Volume 138 () nr. C pages p.
Year: 2022
Contents:
Publisher: Published by Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 103 of 115 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands