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                                       Details for article 5 of 27 found articles
 
 
  BEoL stack robustness investigations utilizing Cu-pillar immobilization and micromechanical loading methods
 
 
Title: BEoL stack robustness investigations utilizing Cu-pillar immobilization and micromechanical loading methods
Author: Silomon, Jendrik
Chimeg, Dulguun
Gluch, Jürgen
Clausner, André
Zschech, Ehrenfried
Appeared in: Microelectronics reliability
Paging: Volume 136 () nr. C pages p.
Year: 2022
Contents:
Publisher: Published by Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 5 of 27 found articles
 
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