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                                       Details for article 6 of 8 found articles
 
 
  Microstructure evolution and mechanical properties changes during the formation of full Cu41Sn11 joint in high-temperature electronic packaging
 
 
Title: Microstructure evolution and mechanical properties changes during the formation of full Cu41Sn11 joint in high-temperature electronic packaging
Author: Yang, Gangli
Li, Xiaoyan
Han, Xu
Zhang, Hu
Wen, Linjie
Li, Shanshan
Appeared in: Microelectronics reliability
Paging: Volume 130 () nr. C pages p.
Year: 2022
Contents:
Publisher: Published by Elsevier B.V.
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 6 of 8 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands