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Journal description
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Details for article 5 of 8 found articles
| Title: |
Investigation into thermo-mechanical reliability of copper trace lines in stacked dies ball grid array packaging |
| Author: |
Shih, Meng-Kai Shih, Sean Liao, Tse-Wei Chen, Dao-Long Liu, D.S. Tarng, David |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 130 () nr. C pages p. |
| Year: |
2022 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 5 of 8 found articles
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