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Journal description
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Details for article 7 of 14 found articles
| Title: |
Impact of electric field at rough copper lines on failure time due to electrochemical migration in PCBs |
| Author: |
Reiss, Georg Kosednar-Legenstein, Barbara Riedler, Johann Eßl, Werner |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 117 () nr. C pages p. |
| Year: |
2021 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 7 of 14 found articles
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