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Journal description
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Details for article 1 of 12 found articles
| Title: |
A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow |
| Author: |
Wang, Jing Niu, Yuling Shao, Shuai Wang, Huayan Xu, Jiefeng Pham, Vanlai Park, Seungbae |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 112 () nr. C pages p. |
| Year: |
2020 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 1 of 12 found articles
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