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Journal description
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Details for article 8 of 22 found articles
| Title: |
Effect of intermetallic compound thickness on mechanical fatigue properties of copper pillar micro-bumps |
| Author: |
Zhu, Wenhui Shi, Lei Jiang, Liulu He, Hu |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 111 () nr. C pages p. |
| Year: |
2020 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 8 of 22 found articles
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