|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 63 of 551 found articles
| Title: |
A three-scale approach to the numerical simulation of metallic bonding for MEMS packaging |
| Author: |
Ghisi, Aldo Mariani, Stefano Corigliano, Alberto Allegato, Giorgio Oggioni, Laura |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 54 (2014) nr. 9-10 pages 5 p. |
| Year: |
2014 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 63 of 551 found articles
| << previous | next >> |