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In-situ chemical polymerization of Cu-Polythiophenes composite film as seed layer for direct electroplating on insulating substrate |
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Titel: |
In-situ chemical polymerization of Cu-Polythiophenes composite film as seed layer for direct electroplating on insulating substrate |
Auteur: |
Li, Jiujuan Zhou, Guoyun Hong, Yan He, Wei Wang, Shouxu Wang, Chong Chen, Yuanming Zhou, Jinqun Miao, Hua Weng, Zesheng Andersson, Martin |
Verschenen in: |
Electrochimica acta |
Paginering: |
Jaargang 330 () nr. C pagina's p. |
Jaar: |
2020 |
Inhoud: |
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Uitgever: |
Elsevier Ltd |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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