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In-situ chemical polymerization of Cu-Polythiophenes composite film as seed layer for direct electroplating on insulating substrate |
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Title: |
In-situ chemical polymerization of Cu-Polythiophenes composite film as seed layer for direct electroplating on insulating substrate |
Author: |
Li, Jiujuan Zhou, Guoyun Hong, Yan He, Wei Wang, Shouxu Wang, Chong Chen, Yuanming Zhou, Jinqun Miao, Hua Weng, Zesheng Andersson, Martin |
Appeared in: |
Electrochimica acta |
Paging: |
Volume 330 () nr. C pages p. |
Year: |
2020 |
Contents: |
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Publisher: |
Elsevier Ltd |
Source file: |
Elektronische Wetenschappelijke Tijdschriften |
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