A facile process combined with inkjet printing, surface modification and electroless deposition to fabricate adhesion-enhanced copper patterns on flexible polymer substrates for functional flexible electronics
Titel:
A facile process combined with inkjet printing, surface modification and electroless deposition to fabricate adhesion-enhanced copper patterns on flexible polymer substrates for functional flexible electronics
Auteur:
Wang, Yan Wang, Yu Chen, Jin-ju Guo, Hong Liang, Kun Marcus, Kyle Peng, Qi-ling Zhang, Jing Feng, Zhe-sheng