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  A facile process combined with inkjet printing, surface modification and electroless deposition to fabricate adhesion-enhanced copper patterns on flexible polymer substrates for functional flexible electronics
 
 
Title: A facile process combined with inkjet printing, surface modification and electroless deposition to fabricate adhesion-enhanced copper patterns on flexible polymer substrates for functional flexible electronics
Author: Wang, Yan
Wang, Yu
Chen, Jin-ju
Guo, Hong
Liang, Kun
Marcus, Kyle
Peng, Qi-ling
Zhang, Jing
Feng, Zhe-sheng
Appeared in: Electrochimica acta
Paging: Volume 218 (2016) nr. C pages 8 p.
Year: 2016
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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