| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A Hermetic Seal Using Composite Thin-Film In/Sn Solder as an Intermediate Layer and Its Interdiffusion Reaction with Cu
|
Yan, Li-ling
|
|
2008
|
38 |
1 |
p. 200-207
|
artikel
|
| 2 |
A Study on a Surface Preparation Method for Single-Crystal SiC Using an Fe Catalyst
|
Kubota, Akihisa
|
|
2008
|
38 |
1 |
p. 159-163
|
artikel
|
| 3 |
Ceramic Substrates for High-temperature Electronic Integration
|
Chasserio, N.
|
|
2008
|
38 |
1 |
p. 164-174
|
artikel
|
| 4 |
Cu-Ni-Sn: A Key System for Lead-Free Soldering
|
Schmetterer, C.
|
|
2008
|
38 |
1 |
p. 10-24
|
artikel
|
| 5 |
Effect of Cu Thickness on the Evolution of the Reaction Products at the Sn-9wt.%Zn Solder/Cu Interface During Reflow
|
Chen, Chih-hao
|
|
2008
|
38 |
1 |
p. 61-69
|
artikel
|
| 6 |
Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations
|
Kumar, Aditya
|
|
2008
|
38 |
1 |
p. 78-87
|
artikel
|
| 7 |
Effect of Ni-Cr Layer on Adhesion Strength of Flexible Copper Clad Laminate
|
Noh, Bo-In
|
|
2008
|
38 |
1 |
p. 46-53
|
artikel
|
| 8 |
Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM
|
Kim, Dong Hoon
|
|
2008
|
38 |
1 |
p. 39-45
|
artikel
|
| 9 |
Electromigration Behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu Flip-Chip Solder Joints under High Current Density
|
Ha, Sang-Su
|
|
2008
|
38 |
1 |
p. 70-77
|
artikel
|
| 10 |
Fabrication of Mesa Shaped InGaN-Based Light-Emitting Diodes Through a Photoelectrochemical Process
|
Yang, Chung-Chieh
|
|
2008
|
38 |
1 |
p. 145-152
|
artikel
|
| 11 |
Factors That Govern the Performance of Thermal Interface Materials
|
Pour Shahid Saeed Abadi, Parisa
|
|
2008
|
38 |
1 |
p. 175-192
|
artikel
|
| 12 |
Foreword
|
Chen, Sinn-wen
|
|
2008
|
38 |
1 |
p. 1
|
artikel
|
| 13 |
Improvement of Thermal Fatigue Properties of Sn-Ag-Cu Lead-Free Solder Interconnects on Casio’s Wafer-Level Packages Based on Morphology and Grain Boundary Character
|
Terashima, S.
|
|
2008
|
38 |
1 |
p. 33-38
|
artikel
|
| 14 |
Interfacial Reaction and Wetting Behavior Between Pt and Molten Solder
|
Yang, S.C.
|
|
2008
|
38 |
1 |
p. 25-32
|
artikel
|
| 15 |
Interfacial Reaction between Zn-Al-Based High-Temperature Solders and Ni Substrate
|
Takaku, Yoshikazu
|
|
2008
|
38 |
1 |
p. 54-60
|
artikel
|
| 16 |
Interfacial Reactions Between Pb-Free Solders and In/Ni/Cu Multilayer Substrates
|
Yen, Yee-Wen
|
|
2008
|
38 |
1 |
p. 93-99
|
artikel
|
| 17 |
Microstructural Evolution of Alloy Powder for Electronic Materials with Liquid Miscibility Gap
|
Ohnuma, I.
|
|
2008
|
38 |
1 |
p. 2-9
|
artikel
|
| 18 |
Multiple-Scale Analysis of Charge Transport in Semiconductor Radiation Detectors: Application to Semi-Insulating CdZnTe
|
Bale, Derek S.
|
|
2008
|
38 |
1 |
p. 126-144
|
artikel
|
| 19 |
Nearly Perfect Electrical Activation Efficiencies from Silicon-Implanted AlxGa1−xN with High Aluminum Mole Fraction
|
Moore, E.A.
|
|
2008
|
38 |
1 |
p. 153-158
|
artikel
|
| 20 |
Optical Characteristics of ZnTeO Thin Films Synthesized by Pulsed Laser Deposition and Molecular Beam Epitaxy
|
Wang, W.
|
|
2008
|
38 |
1 |
p. 119-125
|
artikel
|
| 21 |
Phase Transitions in the BiVO4-nPbO (n = 1, 2) System: Structural–Electrical Properties Relationships
|
Wignacourt, Jean-Pierre
|
|
2008
|
38 |
1 |
p. 113-118
|
artikel
|
| 22 |
Reflectivity and Abnormal Absorption at ITO/Al Interface
|
Lin, Y.H.
|
|
2008
|
38 |
1 |
p. 108-112
|
artikel
|
| 23 |
Simulation, Modeling, and Crystal Growth of Cd0.9Zn0.1Te for Nuclear Spectrometers
|
Mandal, Krishna C.
|
|
2008
|
38 |
1 |
p. 208
|
artikel
|
| 24 |
Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints
|
Lai, R. S.
|
|
2008
|
38 |
1 |
p. 88-92
|
artikel
|
| 25 |
Synthesis of Nanostructured Carbon Materials on a Tin Thin Film Using Phenol Formaldehyde as the Carbon Source
|
Chen, Chih-ming
|
|
2008
|
38 |
1 |
p. 193-199
|
artikel
|
| 26 |
Thermal Stability Study of Cu(MoNx) Seed Layer on Barrierless Si
|
Chu, J.P.
|
|
2008
|
38 |
1 |
p. 100-107
|
artikel
|
Tijdschrift beschrijving