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Journal description
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Details for article 8 of 26 found articles
| Title: |
Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM |
| Author: |
Kim, Dong Hoon Cho, Moon Gi Seo, Sun-Kyoung Lee, Hyuck Mo |
| Appeared in: |
Journal of electronic materials |
| Paging: | Volume 38 (2008) nr. 1 pages 39-45 |
| Year: |
2008 |
| Contents: | |
| Publisher: |
Springer US, Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 8 of 26 found articles
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