| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Analysis of interface trap density of metal–oxide-semiconductor devices with Pr2O3 gate dielectric using conductance method
|
Jeon, Sanghun
|
|
2011
|
|
6 |
p. 872-876
5 p.
|
artikel
|
| 2 |
Characterization of adhesion property between fused silica and thermoplastic polymer film in thermal nanoimprint lithography using a novel pull-off test
|
Kim, Kwang-Seop
|
|
2011
|
|
6 |
p. 855-860
6 p.
|
artikel
|
| 3 |
Chemisorption sensing and analysis using silicon cantilever sensor based on n-type metal–oxide–semiconductor transistor
|
Wang, Jian
|
|
2011
|
|
6 |
p. 1019-1023
5 p.
|
artikel
|
| 4 |
Contents Continued
|
|
|
2011
|
|
6 |
p. IV-
1 p.
|
artikel
|
| 5 |
Controlling of electronic parameters of GaAs Schottky diode by poly(3,4-ethylenedioxithiophene)-block-poly(ethylene glycol) organic interlayer
|
Aydın, Mehmet Enver
|
|
2011
|
|
6 |
p. 867-871
5 p.
|
artikel
|
| 6 |
Development of metal etch mask by single layer lift-off for silicon nitride photonic crystals
|
Lim, Kang-mook
|
|
2011
|
|
6 |
p. 994-998
5 p.
|
artikel
|
| 7 |
Direct fabricating patterns using stamping transfer process with PDMS mold of hydrophobic nanostructures on surface of micro-cavity
|
Huang, Yi-Hao
|
|
2011
|
|
6 |
p. 849-854
6 p.
|
artikel
|
| 8 |
Effect of hydrogen peroxide concentration on surface micro- roughness of silicon wafer after final polishing
|
Wang, Haibo
|
|
2011
|
|
6 |
p. 1010-1015
6 p.
|
artikel
|
| 9 |
Effect of interfacial fluorination on the electrical properties of the inter-poly high-k dielectrics
|
Hsieh, Chih-Ren
|
|
2011
|
|
6 |
p. 945-949
5 p.
|
artikel
|
| 10 |
Effect of porogen residue on electrical characteristics of ultra low-k materials
|
Baklanov, Mikhail R.
|
|
2011
|
|
6 |
p. 990-993
4 p.
|
artikel
|
| 11 |
Effect of PVP-coated silver nanoparticles using laser direct patterning process by photothermal effect
|
Cheng, Yi-Ting
|
|
2011
|
|
6 |
p. 929-934
6 p.
|
artikel
|
| 12 |
Electrical characteristics and TDDB breakdown mechanism of N2-RTA-treated Hf-based high-κ gate dielectrics
|
Lin, Cheng-Li
|
|
2011
|
|
6 |
p. 950-958
9 p.
|
artikel
|
| 13 |
Estimation of resist profile for line/space patterns using layer-based exposure modeling in electron-beam lithography
|
Dai, Q.
|
|
2011
|
|
6 |
p. 902-908
7 p.
|
artikel
|
| 14 |
Fabrication and adhesion strength of Cu/Ni–Cr/polyimide films for flexible printed circuits
|
Noh, Bo-In
|
|
2011
|
|
6 |
p. 1024-1027
4 p.
|
artikel
|
| 15 |
Fabrication of gold sub-wavelength pore array using gas-assisted hot embossing with anodic aluminum oxide (AAO) template
|
Chang, Wei-Yi
|
|
2011
|
|
6 |
p. 909-913
5 p.
|
artikel
|
| 16 |
Flexible electronics: Prediction of substrate deformation during different steps of the lithography process
|
Barink, Marco
|
|
2011
|
|
6 |
p. 999-1005
7 p.
|
artikel
|
| 17 |
HF contamination of 200mm Al wafers: A parallel angle resolved XPS study
|
Pelissier, B.
|
|
2011
|
|
6 |
p. 861-866
6 p.
|
artikel
|
| 18 |
High-temperature lead-free solder alternatives
|
Chidambaram, Vivek
|
|
2011
|
|
6 |
p. 981-989
9 p.
|
artikel
|
| 19 |
Improved switching uniformity of a carbon-based conductive-bridge type ReRAM by controlling the size of conducting filament
|
Park, Jubong
|
|
2011
|
|
6 |
p. 935-938
4 p.
|
artikel
|
| 20 |
Influence of dummy active patterns on mechanical stress induced by spin-on-glass-filled shallow trench isolation in n-MOSFETs
|
Kim, Dongwoo
|
|
2011
|
|
6 |
p. 882-887
6 p.
|
artikel
|
| 21 |
Inside Front Cover - Editorial Board
|
|
|
2011
|
|
6 |
p. IFC-
1 p.
|
artikel
|
| 22 |
Integration of thin film bulk acoustic resonators onto flexible liquid crystal polymer substrates
|
Wright, R.V.
|
|
2011
|
|
6 |
p. 1006-1009
4 p.
|
artikel
|
| 23 |
Investigation of barrier inhomogeneities in Mo/4H–SiC Schottky diodes
|
Boussouar, L.
|
|
2011
|
|
6 |
p. 969-975
7 p.
|
artikel
|
| 24 |
Multi-dimensional data registration CMOS/MEMS integrated inkjet printhead
|
Liou, Jian-Chiun
|
|
2011
|
|
6 |
p. 888-901
14 p.
|
artikel
|
| 25 |
Optical characterization of anatase TiO2 films patterned by direct ultraviolet-assisted nanoimprint lithography
|
Park, Hyeong-Ho
|
|
2011
|
|
6 |
p. 923-928
6 p.
|
artikel
|
| 26 |
Patterning of SiO2 nanoparticle–PMMA polymer composite microstructures based on soft lithographic techniques
|
Singh, Akanksha
|
|
2011
|
|
6 |
p. 939-944
6 p.
|
artikel
|
| 27 |
Press and release imprint: Control of the flexible mold deformation and the local variation of residual layer thickness in soft UV-NIL
|
Koo, Namil
|
|
2011
|
|
6 |
p. 1033-1036
4 p.
|
artikel
|
| 28 |
Realization of planar mixing by chaotic velocity in microfluidics
|
Zhang, Kai
|
|
2011
|
|
6 |
p. 959-963
5 p.
|
artikel
|
| 29 |
Shear-mode PMN-PT piezoelectric single crystal resonator for microfluidic applications
|
Zhang, Kai
|
|
2011
|
|
6 |
p. 1028-1032
5 p.
|
artikel
|
| 30 |
Temperature dependent current–voltage characteristics of n-Mg x Zn1− x O/p-GaN junction diodes
|
Hsueh, Kuang-Po
|
|
2011
|
|
6 |
p. 1016-1018
3 p.
|
artikel
|
| 31 |
The effect of light irradiation on electrons and holes trapping in nonvolotile memory capacitors employing sub 10nm SiO2–HfO2 stacks and Au nanocrystals
|
Mikhelashvili, V.
|
|
2011
|
|
6 |
p. 964-968
5 p.
|
artikel
|
| 32 |
The fabrication and dry etching of poly-Si/TaN/Mo gate stack in the metal inserted poly-Si stack structure
|
Li, Yongliang
|
|
2011
|
|
6 |
p. 976-980
5 p.
|
artikel
|
| 33 |
The fabrication of three-dimensional nano-structures by defocused electron beam energy
|
Oh, Seung Hun
|
|
2011
|
|
6 |
p. 914-922
9 p.
|
artikel
|
| 34 |
Ultradense silicon nanowire arrays produced via top-down planar technology
|
Ferri, M.
|
|
2011
|
|
6 |
p. 877-881
5 p.
|
artikel
|
| 35 |
V2O4–PEPC composite based pressure sensor
|
Karimov, Kh.S.
|
|
2011
|
|
6 |
p. 1037-1041
5 p.
|
artikel
|
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