| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A design and qualification of LED flip Chip-on-Board module with tunable color temperatures
|
Fan, Jiajie
|
|
2018
|
84 |
C |
p. 140-148
|
artikel
|
| 2 |
A double snapback SCR ESD protection scheme for 28 nm CMOS process
|
Hu, Tao
|
|
2018
|
84 |
C |
p. 20-25
|
artikel
|
| 3 |
A hybrid approach for UAV flight data estimation and prediction based on flight mode recognition
|
Wang, Benkuan
|
|
2018
|
84 |
C |
p. 253-262
|
artikel
|
| 4 |
A new health estimation model for CNC machine tool based on infinite irrelevance and belief rule base
|
Yin, Xiaojing
|
|
2018
|
84 |
C |
p. 187-196
|
artikel
|
| 5 |
Auxiliary power unit failure prediction using quantified generalized renewal process
|
Zhang, Yujie
|
|
2018
|
84 |
C |
p. 215-225
|
artikel
|
| 6 |
Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints
|
Li, Jianfeng
|
|
2018
|
84 |
C |
p. 55-65
|
artikel
|
| 7 |
Cooling performance and characteristics of metal piezoelectric fans in a heat sink-equipped handheld projector
|
Shyu, Jin-Cherng
|
|
2018
|
84 |
C |
p. 75-87
|
artikel
|
| 8 |
Editorial Board
|
|
|
2018
|
84 |
C |
p. ii
|
artikel
|
| 9 |
Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment
|
Manoharan, Subramani
|
|
2018
|
84 |
C |
p. 197-207
|
artikel
|
| 10 |
Effect of lanthanum silicate interface layer on the electrical characteristics of 4H-SiC metal-oxide-semiconductor capacitors
|
Lei, Y.M.
|
|
2018
|
84 |
C |
p. 248-252
|
artikel
|
| 11 |
Energy-Delay-FIT Product to compare processors and algorithm implementations
|
Fratin, V.
|
|
2018
|
84 |
C |
p. 112-120
|
artikel
|
| 12 |
FFT analysis of temperature modulated semiconductor gas sensor response for the prediction of ammonia concentration under humidity interference
|
Wozniak, Lukasz
|
|
2018
|
84 |
C |
p. 163-169
|
artikel
|
| 13 |
FPGA-based design of advanced BMS implementing SoC/SoH estimators
|
Kumar, Bijender
|
|
2018
|
84 |
C |
p. 66-74
|
artikel
|
| 14 |
Improvement of SiO2/4H-SiC Interface properties by post-metallization annealing
|
Lei, Y.M.
|
|
2018
|
84 |
C |
p. 226-229
|
artikel
|
| 15 |
Improving ESD protection of 5 V NMOSFET large array device in 0.4 μm BCD process
|
Huang, Shao-Chang
|
|
2018
|
84 |
C |
p. 48-54
|
artikel
|
| 16 |
In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging
|
Khalilullah, Ibrahim
|
|
2018
|
84 |
C |
p. 208-214
|
artikel
|
| 17 |
Investigation and impact of LDD variations on the drain disturb in normally-on SONOS NOR flash device
|
Xu, Zhaozhao
|
|
2018
|
84 |
C |
p. 157-162
|
artikel
|
| 18 |
Investigation of enhanced low dose rate sensitivity in SiGe HBTs by 60Co γ irradiation under different biases
|
Zhang, Jin-xin
|
|
2018
|
84 |
C |
p. 105-111
|
artikel
|
| 19 |
Investigation on nano-reinforced solder paste after reflow soldering part 1: Effects of nano-reinforced solder paste on melting, hardness, spreading rate, and wetting quality
|
Chellvarajoo, Srivalli
|
|
2018
|
84 |
C |
p. 230-237
|
artikel
|
| 20 |
Multistage performance deterioration in n-type crystalline silicon photovoltaic modules undergoing potential-induced degradation
|
Komatsu, Yutaka
|
|
2018
|
84 |
C |
p. 127-133
|
artikel
|
| 21 |
Optical coupling with flexible polymer waveguides for chip-to-chip interconnects in electronic systems
|
Nieweglowski, Krzysztof
|
|
2018
|
84 |
C |
p. 121-126
|
artikel
|
| 22 |
Performance evaluation for a novel optoelectronic device for noninvasive monitoring thrombosis
|
Zhao, Ke
|
|
2018
|
84 |
C |
p. 134-139
|
artikel
|
| 23 |
Physics-based modeling of TID induced global static leakage in different CMOS circuits
|
Zebrev, Gennady I.
|
|
2018
|
84 |
C |
p. 181-186
|
artikel
|
| 24 |
Reliability analysis of vibrating electronic assemblies using analytical solutions and response surface methodology
|
Gharaibeh, Mohammad A.
|
|
2018
|
84 |
C |
p. 238-247
|
artikel
|
| 25 |
Reliability comparison of 28 V–50 V GaN-on-SiC S-band and X-band technologies
|
Gajewski, Donald A.
|
|
2018
|
84 |
C |
p. 1-6
|
artikel
|
| 26 |
Reliable real-time task scheduler based on Rocket Queue architecture
|
Kohútka, L.
|
|
2018
|
84 |
C |
p. 7-19
|
artikel
|
| 27 |
Signal characteristic and test exploitation for intermittent nanometer-scale cracks
|
Lee, Hosung
|
|
2018
|
84 |
C |
p. 26-36
|
artikel
|
| 28 |
Stability of low ohmic thick-film resistors under pulsed operation
|
Dąbrowski, Arkadiusz
|
|
2018
|
84 |
C |
p. 95-104
|
artikel
|
| 29 |
Stability of miniaturized non-trimmed thick- and thin-film resistors
|
Rovensky, Tibor
|
|
2018
|
84 |
C |
p. 88-94
|
artikel
|
| 30 |
The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: Review
|
Liu, Shiqian
|
|
2018
|
84 |
C |
p. 170-180
|
artikel
|
| 31 |
Thermal performance modeling of loop heat pipes with flat evaporator for electronics cooling
|
Gabsi, I.
|
|
2018
|
84 |
C |
p. 37-47
|
artikel
|
| 32 |
Understanding chromaticity shifts in LED devices through analytical models
|
Davis, J. Lynn
|
|
2018
|
84 |
C |
p. 149-156
|
artikel
|
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