| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A fusion prognostics-based qualification test methodology for microelectronic products
|
Pecht, Michael
|
|
2016
|
63 |
C |
p. 320-324
5 p.
|
artikel
|
| 2 |
An SEU resilient, SET filterable and cost effective latch in presence of PVT variations
|
Yan, Aibin
|
|
2016
|
63 |
C |
p. 239-250
12 p.
|
artikel
|
| 3 |
Applications of the pulsed current-voltage (I-V) and capacitance-voltage (C-V) techniques for high-resistive gates in MOSFETs
|
Lai, LiLung
|
|
2016
|
63 |
C |
p. 22-30
9 p.
|
artikel
|
| 4 |
Band diagram for low-k/Cu interconnects: The starting point for understanding back-end-of-line (BEOL) electrical reliability
|
Mutch, Michael J.
|
|
2016
|
63 |
C |
p. 201-213
13 p.
|
artikel
|
| 5 |
Chip package interaction for LED packages
|
Zhang, Sung-Uk
|
|
2016
|
63 |
C |
p. 76-81
6 p.
|
artikel
|
| 6 |
Choice of granularity for reliable circuit design using dynamic reconfiguration
|
Mukherjee, Atin
|
|
2016
|
63 |
C |
p. 291-303
13 p.
|
artikel
|
| 7 |
Compact distributed multi-finger MOSFET model for circuit-level ESD simulation
|
Meng, Kuo-hsuan
|
|
2016
|
63 |
C |
p. 11-21
11 p.
|
artikel
|
| 8 |
Degradation of a sintered Cu nanoparticle layer studied by synchrotron radiation computed laminography
|
Usui, Masanori
|
|
2016
|
63 |
C |
p. 152-158
7 p.
|
artikel
|
| 9 |
DMR+: An efficient alternative to TMR to protect registers in Xilinx FPGAs
|
Reviriego, P.
|
|
2016
|
63 |
C |
p. 314-318
5 p.
|
artikel
|
| 10 |
Drain current model for short-channel triple gate junctionless nanowire transistors
|
Paz, B.C.
|
|
2016
|
63 |
C |
p. 1-10
10 p.
|
artikel
|
| 11 |
Drop-shock reliability improvement of embedded chip resistor packages through via structure modification
|
Park, Se-Hoon
|
|
2016
|
63 |
C |
p. 194-200
7 p.
|
artikel
|
| 12 |
Editorial Board
|
|
|
2016
|
63 |
C |
p. IFC-
1 p.
|
artikel
|
| 13 |
Effects of oxidation on reliability of screen-printed silver circuits for radio frequency applications
|
Kim, Dae Up
|
|
2016
|
63 |
C |
p. 120-124
5 p.
|
artikel
|
| 14 |
ELDRS in SiGe transistors for room and low-temperature irradiation
|
Pershenkov, V.S.
|
|
2016
|
63 |
C |
p. 56-59
4 p.
|
artikel
|
| 15 |
Evaluation of SiC MOSFET power modules under unclamped inductive switching test environment
|
Nawaz, Muhammad
|
|
2016
|
63 |
C |
p. 97-103
7 p.
|
artikel
|
| 16 |
Experimental investigation of temperature and relative humidity effects on resonance frequency and quality factor of CMOS-MEMS paddle resonator
|
Jan, Mohammad Tariq
|
|
2016
|
63 |
C |
p. 82-89
8 p.
|
artikel
|
| 17 |
Extend orthogonal Latin square codes for 32-bit data protection in memory applications
|
Liu, Shanshan
|
|
2016
|
63 |
C |
p. 278-283
6 p.
|
artikel
|
| 18 |
Fabrication and stress analysis of annular-trench-isolated TSV
|
Feng, Wei
|
|
2016
|
63 |
C |
p. 142-147
6 p.
|
artikel
|
| 19 |
High-resolution wide-band LC-VCO for reliable operation in phase-locked loops
|
Sánchez-Azqueta, C.
|
|
2016
|
63 |
C |
p. 251-255
5 p.
|
artikel
|
| 20 |
Identifying the spatial position and properties of traps in GaN HEMTs using current transient spectroscopy
|
Zheng, Xiang
|
|
2016
|
63 |
C |
p. 46-51
6 p.
|
artikel
|
| 21 |
Impact toughness, hardness and shear strength of Fe and Bi added Sn-1Ag-0.5Cu lead-free solders
|
Ali, Bakhtiar
|
|
2016
|
63 |
C |
p. 224-230
7 p.
|
artikel
|
| 22 |
Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution
|
Lim, Adeline B.Y.
|
|
2016
|
63 |
C |
p. 214-223
10 p.
|
artikel
|
| 23 |
Investigation into sand mura effects of a-IGZO TFT LCDs
|
Liu, Xiang
|
|
2016
|
63 |
C |
p. 148-151
4 p.
|
artikel
|
| 24 |
Investigation on the CPU nanofluid cooling
|
Al-Rashed, Mohsen H.
|
|
2016
|
63 |
C |
p. 159-165
7 p.
|
artikel
|
| 25 |
Mechanical analysis of wafer testing with FEM simulations
|
Brezmes, Angel Ochoa
|
|
2016
|
63 |
C |
p. 166-182
17 p.
|
artikel
|
| 26 |
Microstructural and thermal characterizations of light-emitting diode employing a low-temperature die-bonding material
|
Wang, Tzu-Hao
|
|
2016
|
63 |
C |
p. 68-75
8 p.
|
artikel
|
| 27 |
Microstructural evolution of sintered silver at elevated temperatures
|
Paknejad, Seyed Amir
|
|
2016
|
63 |
C |
p. 125-133
9 p.
|
artikel
|
| 28 |
Modeling and analysis of crosstalk induced overshoot/undershoot effects in multilayer graphene nanoribbon interconnects and its impact on gate oxide reliability
|
Sahoo, M.
|
|
2016
|
63 |
C |
p. 231-238
8 p.
|
artikel
|
| 29 |
Modeling of data retention statistics of phase-change memory with confined- and mushroom-type cells
|
Kwon, Yongwoo
|
|
2016
|
63 |
C |
p. 284-290
7 p.
|
artikel
|
| 30 |
Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages
|
Mahan, Kenny
|
|
2016
|
63 |
C |
p. 134-141
8 p.
|
artikel
|
| 31 |
[No title]
|
Gan, Chong Leong
|
|
2016
|
63 |
C |
p. 319-320
2 p.
|
artikel
|
| 32 |
On designing an efficient numerical-based forbidden pattern free crosstalk avoidance codec for reliable data transfer of NoCs
|
Shirmohammadi, Zahra
|
|
2016
|
63 |
C |
p. 304-313
10 p.
|
artikel
|
| 33 |
On the series resistance in staggered amorphous thin film transistors
|
Cerdeira, Antonio
|
|
2016
|
63 |
C |
p. 325-335
11 p.
|
artikel
|
| 34 |
Piezoelectric oscillating cantilever fan for thermal management of electronics and LEDs — A review
|
Maaspuro, Mika
|
|
2016
|
63 |
C |
p. 342-353
12 p.
|
artikel
|
| 35 |
Poly-Si gate electrodes for AlGaN/GaN HEMT with high reliability and low gate leakage current
|
Chen, J.
|
|
2016
|
63 |
C |
p. 52-55
4 p.
|
artikel
|
| 36 |
Protrusion of electroplated copper filled in through silicon vias during annealing process
|
Chen, Si
|
|
2016
|
63 |
C |
p. 183-193
11 p.
|
artikel
|
| 37 |
Pump chip and phosphor reliability of broadband light-emitting diodes
|
Rahman, Faiz
|
|
2016
|
63 |
C |
p. 60-67
8 p.
|
artikel
|
| 38 |
PVTA-aware approximate custom instruction extension technique: A cross-layer approach
|
Farahani, Bahar
|
|
2016
|
63 |
C |
p. 267-277
11 p.
|
artikel
|
| 39 |
Reliability analysis of 3D heterogeneous microsystem module by simplified finite element model
|
Yeh, Meng-Kao
|
|
2016
|
63 |
C |
p. 111-119
9 p.
|
artikel
|
| 40 |
Reliability/Uniformity improvement induced by an ultrathin TiO2 insertion in Ti/HfO2/Pt resistive switching memories
|
Jiang, Ran
|
|
2016
|
63 |
C |
p. 37-41
5 p.
|
artikel
|
| 41 |
Resistive switching properties of a thin SiO2 layer with CeOx buffer layer on n+ and p+ Si bottom electrodes
|
Hadi, M.S.
|
|
2016
|
63 |
C |
p. 42-45
4 p.
|
artikel
|
| 42 |
Self-repairing radix-2 signed-digit adder with multiple error detection, correction, and fault localization
|
Moradian, Hossein
|
|
2016
|
63 |
C |
p. 256-266
11 p.
|
artikel
|
| 43 |
Temperature-dependent resistive switching characteristics for Au/n-type CuAlO x /heavily doped p-type Si devices
|
Lin, Yow-Jon
|
|
2016
|
63 |
C |
p. 31-36
6 p.
|
artikel
|
| 44 |
The reliability of wire bonding using Ag and Al
|
Schneider-Ramelow, Martin
|
|
2016
|
63 |
C |
p. 336-341
6 p.
|
artikel
|
| 45 |
Thermal characterization of planar high temperature power module packages with sintered nanosilver interconnection
|
Berry, David
|
|
2016
|
63 |
C |
p. 104-110
7 p.
|
artikel
|
| 46 |
Wafer level measurements and numerical analysis of self-heating phenomena in nano-scale SOI MOSFETs
|
Garegnani, Giacomo
|
|
2016
|
63 |
C |
p. 90-96
7 p.
|
artikel
|
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