nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A compact model for NBTI degradation and recovery under use-profile variations and its application to aging analysis of digital integrated circuits
|
Kleeberger, Veit B. |
|
2014 |
54 |
6-7 |
p. 1083-1089 7 p. |
artikel |
2 |
A graph based approach for reliability analysis of nano-scale VLSI logic circuits
|
Vaghef, Vahid Hamiyati |
|
2014 |
54 |
6-7 |
p. 1299-1306 8 p. |
artikel |
3 |
Analysis of Harmonic distortion in asymmetric underlap DG-MOSFET with high-k spacer
|
Dutta, Arka |
|
2014 |
54 |
6-7 |
p. 1125-1132 8 p. |
artikel |
4 |
Analytical compact modeling and statistical variability study of LDMOS
|
Zhou, Hongtao |
|
2014 |
54 |
6-7 |
p. 1096-1102 7 p. |
artikel |
5 |
Analytical solution on interfacial reliability of 3-D through-silicon-via (TSV) containing dielectric liner
|
Ding, Yingtao |
|
2014 |
54 |
6-7 |
p. 1384-1391 8 p. |
artikel |
6 |
An area-efficient LDMOS-SCR ESD protection device for the I/O of power IC application
|
Zeng, Jie |
|
2014 |
54 |
6-7 |
p. 1173-1178 6 p. |
artikel |
7 |
An investigation on capacitance-trigger ESD protection devices for high voltage integrated circuits
|
Liang, Hailian |
|
2014 |
54 |
6-7 |
p. 1169-1172 4 p. |
artikel |
8 |
A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting diodes
|
Ye, Huaiyu |
|
2014 |
54 |
6-7 |
p. 1355-1362 8 p. |
artikel |
9 |
A review: On the development of low melting temperature Pb-free solders
|
Kotadia, Hiren R. |
|
2014 |
54 |
6-7 |
p. 1253-1273 21 p. |
artikel |
10 |
Case studies of defect localization based on software-based fault diagnosis in comparison with PEMS/OBIRCH analysis
|
Naoe, Takuya |
|
2014 |
54 |
6-7 |
p. 1433-1442 10 p. |
artikel |
11 |
Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling
|
Vandevelde, Bart |
|
2014 |
54 |
6-7 |
p. 1200-1205 6 p. |
artikel |
12 |
Computational modeling of creep-based fatigue as a means of selecting lead-free solder alloys
|
Eckermann, J. |
|
2014 |
54 |
6-7 |
p. 1235-1242 8 p. |
artikel |
13 |
Design-in-reliability: From library modeling and optimization to gate-level verification
|
Jain, Palkesh |
|
2014 |
54 |
6-7 |
p. 1421-1432 12 p. |
artikel |
14 |
Device characteristics of AlGaN/GaN MIS–HEMTs with high-k Hf x Zr1 − x O2 (x =0.66,0.47,0.15) insulator layer
|
Chiu, Hsien-Chin |
|
2014 |
54 |
6-7 |
p. 1282-1287 6 p. |
artikel |
15 |
ESD degradation and robustness of RGB LEDs and modules: An investigation based on combined electrical and optical measurements
|
Meneghini, Matteo |
|
2014 |
54 |
6-7 |
p. 1143-1149 7 p. |
artikel |
16 |
Fabrication and application of temperature triggered MEMS switch for active cooling control in Solid State Lighting system
|
Ye, Huaiyu |
|
2014 |
54 |
6-7 |
p. 1338-1343 6 p. |
artikel |
17 |
Flexible stop and double-cascaded stop to improve shock reliability of MEMS accelerometer
|
Tao, Yong-Kang |
|
2014 |
54 |
6-7 |
p. 1328-1337 10 p. |
artikel |
18 |
Geometry optimization of a Lorentz force, resonating MEMS magnetometer
|
Bagherinia, M. |
|
2014 |
54 |
6-7 |
p. 1192-1199 8 p. |
artikel |
19 |
Guest Editorial: 2013 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
|
Wymysłowski, Artur |
|
2014 |
54 |
6-7 |
p. 1179-1181 3 p. |
artikel |
20 |
Improved device variability in scaled MOSFETs with deeply retrograde channel profile
|
Woo, Jason |
|
2014 |
54 |
6-7 |
p. 1090-1095 6 p. |
artikel |
21 |
Improving the reliability of electronic paper display using FMEA and Taguchi methods: A case study
|
Su, Chao-Ton |
|
2014 |
54 |
6-7 |
p. 1369-1377 9 p. |
artikel |
22 |
Influence of bias humidity testing and application on time-dependent, Arrhenius-law-based stability predictions for thin film resistors
|
Kuehl, Reiner W. |
|
2014 |
54 |
6-7 |
p. 1316-1327 12 p. |
artikel |
23 |
Inside front cover - Editorial board
|
|
|
2014 |
54 |
6-7 |
p. IFC- 1 p. |
artikel |
24 |
Mechanical and corrosion resistances of a Sn–0.7wt.%Cu lead-free solder alloy
|
Freitas, Emmanuelle S. |
|
2014 |
54 |
6-7 |
p. 1392-1400 9 p. |
artikel |
25 |
Methodology of reliability enhancement for high power LED driver
|
Lan, Song |
|
2014 |
54 |
6-7 |
p. 1150-1159 10 p. |
artikel |
26 |
Modeling and analysis of gate-all-around silicon nanowire FET
|
Chen, Xiangchen |
|
2014 |
54 |
6-7 |
p. 1103-1108 6 p. |
artikel |
27 |
Monitoring of aging in integrated circuits by identifying possible critical paths
|
Lorenz, Dominik |
|
2014 |
54 |
6-7 |
p. 1075-1082 8 p. |
artikel |
28 |
Multi-physics reliability simulation for solid state lighting drivers
|
Tarashioon, S. |
|
2014 |
54 |
6-7 |
p. 1212-1222 11 p. |
artikel |
29 |
Multi-physics simulations for combined temperature/humidity loading of potted electronic assemblies
|
Parsa, Ehsan |
|
2014 |
54 |
6-7 |
p. 1182-1191 10 p. |
artikel |
30 |
New degradation mechanism observed for AlGaN/GaN HEMTs with sub 100nm scale unpassivated regions around the gate periphery
|
Ivo, Ponky |
|
2014 |
54 |
6-7 |
p. 1288-1292 5 p. |
artikel |
31 |
On the crack and delamination risk optimization of a Si-interposer for LED packaging
|
Auersperg, J. |
|
2014 |
54 |
6-7 |
p. 1223-1227 5 p. |
artikel |
32 |
On the current conduction mechanisms of CeO2/La2O3 stacked gate dielectric
|
Feng, Xuan |
|
2014 |
54 |
6-7 |
p. 1133-1136 4 p. |
artikel |
33 |
Oxygen vacancy formation and the induced defect states in HfO2 and Hf-silicates – A first principles hybrid functional study
|
Chen, Tsung-Ju |
|
2014 |
54 |
6-7 |
p. 1119-1124 6 p. |
artikel |
34 |
Planar copper-tin inter-metallic film formation on strained substrates
|
Hsu, Feng-Chih |
|
2014 |
54 |
6-7 |
p. 1378-1383 6 p. |
artikel |
35 |
Predicting bond failure after 1.5ms of bonding, an initial study
|
Tietäväinen, Aino |
|
2014 |
54 |
6-7 |
p. 1452-1454 3 p. |
artikel |
36 |
Prediction of processing maps for transient liquid phase diffusion bonding of Cu/Sn/Cu joints in microelectronics packaging
|
Park, M.S. |
|
2014 |
54 |
6-7 |
p. 1401-1411 11 p. |
artikel |
37 |
Reliability assessment of a MEMS microphone under mixed flowing gas environment and shock impact loading
|
Li, Jue |
|
2014 |
54 |
6-7 |
p. 1228-1234 7 p. |
artikel |
38 |
Reliability investigation of AlGaN/GaN high electron mobility transistors under reverse-bias stress
|
Chen, Wei-Wei |
|
2014 |
54 |
6-7 |
p. 1293-1298 6 p. |
artikel |
39 |
Resilience Articulation Point (RAP): Cross-layer dependability modeling for nanometer system-on-chip resilience
|
Herkersdorf, Andreas |
|
2014 |
54 |
6-7 |
p. 1066-1074 9 p. |
artikel |
40 |
Robustness measurement of integrated circuits and its adaptation to aging effects
|
Barke, Martin |
|
2014 |
54 |
6-7 |
p. 1058-1065 8 p. |
artikel |
41 |
Self-repairing adder using fault localization
|
Akbar, Muhammad Ali |
|
2014 |
54 |
6-7 |
p. 1443-1451 9 p. |
artikel |
42 |
Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core
|
Weide-Zaage, K. |
|
2014 |
54 |
6-7 |
p. 1206-1211 6 p. |
artikel |
43 |
Snapback breakdown ESD device based on zener diodes on silicon-on-insulator technology
|
Tam, Wing-Shan |
|
2014 |
54 |
6-7 |
p. 1163-1168 6 p. |
artikel |
44 |
Soft error estimation and mitigation of digital circuits by characterizing input patterns of logic gates
|
Rezaei, Siavash |
|
2014 |
54 |
6-7 |
p. 1412-1420 9 p. |
artikel |
45 |
Special section reliability and variability of devices for circuits and systems
|
Asenov, Asen |
|
2014 |
54 |
6-7 |
p. 1057- 1 p. |
artikel |
46 |
Stacked zener trigger SCR for HV IC ESD protection
|
Dong, Shurong |
|
2014 |
54 |
6-7 |
p. 1160-1162 3 p. |
artikel |
47 |
Stress impact of moisture diffusion measured with the stress chip
|
Schindler-Saefkow, F. |
|
2014 |
54 |
6-7 |
p. 1243-1252 10 p. |
artikel |
48 |
Study of body and oxide thickness variation on analog and RF performance of underlap DG-MOSFETs
|
Pati, Sudhansu Kumar |
|
2014 |
54 |
6-7 |
p. 1137-1142 6 p. |
artikel |
49 |
Subthreshold behavior models for short-channel junctionless tri-material cylindrical surrounding-gate MOSFET
|
Li, Cong |
|
2014 |
54 |
6-7 |
p. 1274-1281 8 p. |
artikel |
50 |
Temperature dependences of threshold voltage and drain-induced barrier lowering in 60nm gate length MOS transistors
|
Chen, Zehua |
|
2014 |
54 |
6-7 |
p. 1109-1114 6 p. |
artikel |
51 |
Thermal stability of sectorial split-drain magnetic field-effect transistors
|
Tam, Wing-Shan |
|
2014 |
54 |
6-7 |
p. 1115-1118 4 p. |
artikel |
52 |
Thermal stresses in a multilayered thin film thermoelectric structure
|
Jin, Z.-H. |
|
2014 |
54 |
6-7 |
p. 1363-1368 6 p. |
artikel |
53 |
U- and L-shaped heat pipes heat sinks for cooling electronic components employed a least square smoothing method
|
Wang, Jung-Chang |
|
2014 |
54 |
6-7 |
p. 1344-1354 11 p. |
artikel |
54 |
Useful lifetime analysis for high-power white LEDs
|
Wang, Fu-Kwun |
|
2014 |
54 |
6-7 |
p. 1307-1315 9 p. |
artikel |