| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
An investigation into the crystallization and electric flame-off characteristics of 20μm copper wires
|
Hung, Fei-Yi
|
|
2011
|
51 |
1 |
p. 21-24
4 p.
|
artikel
|
| 2 |
Anomalous microstructure formed at the interface between copper ribbon and tin-deposited copper plate by ultrasonic bonding
|
Maeda, Masakatsu
|
|
2011
|
51 |
1 |
p. 130-136
7 p.
|
artikel
|
| 3 |
A study on the tensile fracture mechanism of 15μm copper wire after EFO process
|
Huang, I-Ting
|
|
2011
|
51 |
1 |
p. 25-29
5 p.
|
artikel
|
| 4 |
Bond reliability under humid environment for coated copper wire and bare copper wire
|
Uno, Tomohiro
|
|
2011
|
51 |
1 |
p. 148-156
9 p.
|
artikel
|
| 5 |
Characteristic of copper wire and transient analysis on wirebonding process
|
Hsu, Hsiang-Chen
|
|
2011
|
51 |
1 |
p. 179-186
8 p.
|
artikel
|
| 6 |
Copper Wire Bonding
|
Mayer, Michael
|
|
2011
|
51 |
1 |
p. 1-2
2 p.
|
artikel
|
| 7 |
Cu wire bond microstructure analysis and failure mechanism
|
Yu, Cheng-Fu
|
|
2011
|
51 |
1 |
p. 119-124
6 p.
|
artikel
|
| 8 |
Cu wire bond parameter optimization on various bond pad metallization and barrier layer material schemes
|
England, Luke
|
|
2011
|
51 |
1 |
p. 81-87
7 p.
|
artikel
|
| 9 |
Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution
|
Xu, H.
|
|
2011
|
51 |
1 |
p. 113-118
6 p.
|
artikel
|
| 10 |
Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding
|
Pequegnat, A.
|
|
2011
|
51 |
1 |
p. 43-52
10 p.
|
artikel
|
| 11 |
Enhancing bondability with coated copper bonding wire
|
Uno, Tomohiro
|
|
2011
|
51 |
1 |
p. 88-96
9 p.
|
artikel
|
| 12 |
Factors affecting the long-term stability of Cu/Al ball bonds subjected to standard and extended high temperature storage
|
Vath III, Charles J.
|
|
2011
|
51 |
1 |
p. 137-147
11 p.
|
artikel
|
| 13 |
Fine pitch copper wire bonding in high volume production
|
Appelt, Bernd K.
|
|
2011
|
51 |
1 |
p. 13-20
8 p.
|
artikel
|
| 14 |
Influence of bonding process parameters on chip cratering and phase formation of Cu ball bonds on AlSiCu during storage at 200°C
|
Schmitz, S.
|
|
2011
|
51 |
1 |
p. 107-112
6 p.
|
artikel
|
| 15 |
Influence of gold pick up on the hardness of copper free air ball
|
Lee, J.
|
|
2011
|
51 |
1 |
p. 30-37
8 p.
|
artikel
|
| 16 |
Inside front cover - Editorial board
|
|
|
2011
|
51 |
1 |
p. IFC-
1 p.
|
artikel
|
| 17 |
Investigation of growth behavior of Al–Cu intermetallic compounds in Cu wire bonding
|
Chen, Jiunn
|
|
2011
|
51 |
1 |
p. 125-129
5 p.
|
artikel
|
| 18 |
Investigation on copper diffusion depth in copper wire bonding
|
Chen, Catherine H.
|
|
2011
|
51 |
1 |
p. 166-170
5 p.
|
artikel
|
| 19 |
Modeling of copper wire bonding process on high power LEDs
|
Chen, Zhaohui
|
|
2011
|
51 |
1 |
p. 171-178
8 p.
|
artikel
|
| 20 |
Nickel–palladium bond pads for copper wire bonding
|
Clauberg, Horst
|
|
2011
|
51 |
1 |
p. 75-80
6 p.
|
artikel
|
| 21 |
Optimization of the Cu wire bonding process for IC assembly using Taguchi methods
|
Su, Chao-Ton
|
|
2011
|
51 |
1 |
p. 53-59
7 p.
|
artikel
|
| 22 |
Overview of wire bonding using copper wire or insulated wire
|
Zhong, Z.W.
|
|
2011
|
51 |
1 |
p. 4-12
9 p.
|
artikel
|
| 23 |
Preface
|
Harman NIST Fellow, George G.
|
|
2011
|
51 |
1 |
p. 3-
1 p.
|
artikel
|
| 24 |
Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding
|
Shah, A.
|
|
2011
|
51 |
1 |
p. 67-74
8 p.
|
artikel
|
| 25 |
Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound
|
Tian, Y.H.
|
|
2011
|
51 |
1 |
p. 157-165
9 p.
|
artikel
|
| 26 |
Role of process parameters on bondability and pad damage indicators in copper ball bonding
|
Qin, I.
|
|
2011
|
51 |
1 |
p. 60-66
7 p.
|
artikel
|
| 27 |
Room temperature wedge–wedge ultrasonic bonding using aluminum coated copper wire
|
Dohle, Rainer
|
|
2011
|
51 |
1 |
p. 97-106
10 p.
|
artikel
|
| 28 |
Silver pick up during tail formation in thermosonic wire bonding process
|
Lee, J.
|
|
2011
|
51 |
1 |
p. 38-42
5 p.
|
artikel
|
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