nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A fritless copper conductor system for power electronic applications
|
Reicher, Roland |
|
2001 |
41 |
4 |
p. 491-498 8 p. |
artikel |
2 |
Calender
|
|
|
2001 |
41 |
4 |
p. I-VI nvt p. |
artikel |
3 |
Determination of trap cross-section in a-Si:H p-i-n diodes parameters using simulation and parameter extraction
|
Estrada, Magali |
|
2001 |
41 |
4 |
p. 605-610 6 p. |
artikel |
4 |
Development of chip-on-flex using SBB flip-chip technology
|
Kumano, Yutaka |
|
2001 |
41 |
4 |
p. 525-530 6 p. |
artikel |
5 |
Effects of base layer thickness on reliability of CVD Si3N4 stack gate dielectrics
|
Eriguchi, Koji |
|
2001 |
41 |
4 |
p. 587-595 9 p. |
artikel |
6 |
Finite element simulation of thermal fatigue in multilayer structures: thermal and mechanical approach
|
Rodriguez, M.P |
|
2001 |
41 |
4 |
p. 517-523 7 p. |
artikel |
7 |
In memory of D. Stewart Peck
|
Stojadinovic, Ninoslav D |
|
2001 |
41 |
4 |
p. 481- 1 p. |
artikel |
8 |
Investigation of stress in shallow trench isolation using UV micro-Raman spectroscopy
|
Dombrowski, K.F. |
|
2001 |
41 |
4 |
p. 511-515 5 p. |
artikel |
9 |
Laser processing for microelectronics packaging applications
|
Illyefalvi-Vitéz, Zsolt |
|
2001 |
41 |
4 |
p. 563-570 8 p. |
artikel |
10 |
Low frequency noise in thin gate oxide MOSFETs
|
Kolarova, R. |
|
2001 |
41 |
4 |
p. 579-585 7 p. |
artikel |
11 |
Low-frequency noise of thick-film resistors as quality and reliability indicator
|
Rocak, Dubravka |
|
2001 |
41 |
4 |
p. 531-542 12 p. |
artikel |
12 |
New assembling technique for BGA packages without thermal processes
|
Videkov, Valentin |
|
2001 |
41 |
4 |
p. 611-615 5 p. |
artikel |
13 |
Optimal Reliability Design: Fundamentals and Applications; Way Kuo, Rajendra Prasad, Frank A. Tillman, Ching-Lai Mwang. Cambridge University Press, Cambridge, 2001, 389+XXI pp. ISBN: 0-521-78127-2 (hardbound)
|
Jevtić, Milan |
|
2001 |
41 |
4 |
p. 623-624 2 p. |
artikel |
14 |
Progress in device isolation technology
|
Schwalke, Udo |
|
2001 |
41 |
4 |
p. 483-490 8 p. |
artikel |
15 |
Reliability of k-out-of-n nonrepairable systems with nonindependent components subjected to common shocks
|
Sarhan, A.M. |
|
2001 |
41 |
4 |
p. 617-621 5 p. |
artikel |
16 |
Reliability studies of two flip-chip BGA packages using power cycling test
|
Qi, Quan |
|
2001 |
41 |
4 |
p. 553-562 10 p. |
artikel |
17 |
Soft breakdown and hard breakdown in ultra-thin oxides
|
Pompl, T. |
|
2001 |
41 |
4 |
p. 543-551 9 p. |
artikel |
18 |
Stress effects of epoxy adhesives on ceramic substrates and magnetics
|
Swanson, Dale W |
|
2001 |
41 |
4 |
p. 499-510 12 p. |
artikel |
19 |
Study on the degradation induced by donor interface state in deep-sub-micron grooved-gate P-channel MOSFET’s
|
Ren, Hongxia |
|
2001 |
41 |
4 |
p. 597-604 8 p. |
artikel |
20 |
Thermal modeling of single event burnout failure in semiconductor power devices
|
Walker, D.G. |
|
2001 |
41 |
4 |
p. 571-578 8 p. |
artikel |