| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
Accuracy of approx confidence bounds using censored Weibull regression data from accelerated life tests
|
|
|
1991
|
31 |
1 |
p. 203-
1 p.
|
article
|
| 2 |
A cluster-modified Poisson model for estimating defect density and yield
|
|
|
1991
|
31 |
1 |
p. 209-
1 p.
|
article
|
| 3 |
Adapting mechanical models to fit electronics
|
|
|
1991
|
31 |
1 |
p. 199-
1 p.
|
article
|
| 4 |
A general theory of software-reliability modeling
|
|
|
1991
|
31 |
1 |
p. 205-
1 p.
|
article
|
| 5 |
Analysis of printed wiring board assembly system
|
|
|
1991
|
31 |
1 |
p. 208-
1 p.
|
article
|
| 6 |
Analysis of temperature dependence of CMOS transistors' threshold voltage
|
Prijić, Z.D.
|
|
1991
|
31 |
1 |
p. 33-37
5 p.
|
article
|
| 7 |
An analytic approach to performing a maintainability demonstration
|
|
|
1991
|
31 |
1 |
p. 206-
1 p.
|
article
|
| 8 |
An automated methodology for generating a fault tree
|
|
|
1991
|
31 |
1 |
p. 207-
1 p.
|
article
|
| 9 |
A newly developed model for stress induced slit-like voiding
|
|
|
1991
|
31 |
1 |
p. 200-
1 p.
|
article
|
| 10 |
A new method to calculate the failure frequency of noncoherent systems
|
|
|
1991
|
31 |
1 |
p. 203-
1 p.
|
article
|
| 11 |
A new technique for imaging the logic state of passivated conductors: biased resistive contrast imaging
|
|
|
1991
|
31 |
1 |
p. 200-
1 p.
|
article
|
| 12 |
An improved minimizing algorithm for sum of disjoint products
|
|
|
1991
|
31 |
1 |
p. 204-
1 p.
|
article
|
| 13 |
An investigation of corrosion on integrated circuits via pressure-temperature-humidity-bias stressing
|
|
|
1991
|
31 |
1 |
p. 200-
1 p.
|
article
|
| 14 |
A non-homogeneous Markov model for phased-mission reliability analysis
|
|
|
1991
|
31 |
1 |
p. 204-
1 p.
|
article
|
| 15 |
A nonparametric-Bayes reliability-growth model
|
|
|
1991
|
31 |
1 |
p. 205-
1 p.
|
article
|
| 16 |
A note on a multi-unit system with r repair facility
|
Sridharan, V.
|
|
1991
|
31 |
1 |
p. 85-89
5 p.
|
article
|
| 17 |
A note on computing environments and network reliability
|
Page, Lavon B.
|
|
1991
|
31 |
1 |
p. 185-186
2 p.
|
article
|
| 18 |
4907230 Apparatus and method for testing printed circuit boards and their components
|
Heller, Rik
|
|
1991
|
31 |
1 |
p. vii-
1 p.
|
article
|
| 19 |
Are electromigration failures lognormally distributed?
|
|
|
1991
|
31 |
1 |
p. 202-
1 p.
|
article
|
| 20 |
A simple approximation to the renewal function
|
|
|
1991
|
31 |
1 |
p. 205-
1 p.
|
article
|
| 21 |
A simple fault-diagnosis system with periodic testing
|
|
|
1991
|
31 |
1 |
p. 205-
1 p.
|
article
|
| 22 |
A time-dependent availability measure for a reparable system subject to catastrophic failures
|
|
|
1991
|
31 |
1 |
p. 206-
1 p.
|
article
|
| 23 |
4902969 Automated burn-in system
|
Gussman, RobertL
|
|
1991
|
31 |
1 |
p. v-
1 p.
|
article
|
| 24 |
Barriers to total quality management in the Department of Defense
|
|
|
1991
|
31 |
1 |
p. 199-
1 p.
|
article
|
| 25 |
Bayes comparison of 2 lognormal reliability functions
|
|
|
1991
|
31 |
1 |
p. 202-
1 p.
|
article
|
| 26 |
Bayesian estimation of reliability function and hazard rate
|
Siddiqui, S.A.
|
|
1991
|
31 |
1 |
p. 53-57
5 p.
|
article
|
| 27 |
Behavioural analysis of a paper production system with different repair policies
|
Kumar, Dinesh
|
|
1991
|
31 |
1 |
p. 47-51
5 p.
|
article
|
| 28 |
Brazing to low-temperature-fired thick films
|
|
|
1991
|
31 |
1 |
p. 210-
1 p.
|
article
|
| 29 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1991
|
31 |
1 |
p. 193-195
3 p.
|
article
|
| 30 |
Classical and Bayes approaches to environmental stress screening (ESS): a comparison
|
|
|
1991
|
31 |
1 |
p. 206-
1 p.
|
article
|
| 31 |
Computing 2-terminal reliability for radio-broadcast networks
|
|
|
1991
|
31 |
1 |
p. 203-204
2 p.
|
article
|
| 32 |
Control of defects in the heteroepitaxial growth of GaAs on silicon
|
|
|
1991
|
31 |
1 |
p. 210-
1 p.
|
article
|
| 33 |
Current transport mechanism of polysilicon-emitter transistor
|
Srivastava, A.
|
|
1991
|
31 |
1 |
p. 27-31
5 p.
|
article
|
| 34 |
D.C. performance of short-channel ion-implanted GaAs MESFETs (the role of gate length shortening)
|
|
|
1991
|
31 |
1 |
p. 211-
1 p.
|
article
|
| 35 |
Decision rule for an exponential reliability function
|
Jòz̀wiak, Ireneusz J.
|
|
1991
|
31 |
1 |
p. 71-73
3 p.
|
article
|
| 36 |
Depth profiling techniques for the elemental analysis of semiconductor layers
|
|
|
1991
|
31 |
1 |
p. 210-
1 p.
|
article
|
| 37 |
Design for manufacturability and yield
|
|
|
1991
|
31 |
1 |
p. 209-
1 p.
|
article
|
| 38 |
Determining optimal redundancy for systems with random lifetimes
|
|
|
1991
|
31 |
1 |
p. 204-
1 p.
|
article
|
| 39 |
Developing a decision support system for optimizing automated wafer fabrication
|
|
|
1991
|
31 |
1 |
p. 207-208
2 p.
|
article
|
| 40 |
4889242 Device for testing and sorting electronic components, more particularly integrated circuit chips
|
Willberg, HansH
|
|
1991
|
31 |
1 |
p. i-ii
nvt p.
|
article
|
| 41 |
Diagnostic-strategy selection for series systems
|
|
|
1991
|
31 |
1 |
p. 205-206
2 p.
|
article
|
| 42 |
Direct chip interconnect using polymer bonding
|
|
|
1991
|
31 |
1 |
p. 208-
1 p.
|
article
|
| 43 |
4899107 Discrete die burn-in for nonpackaged die
|
Corbett, TimJ
|
|
1991
|
31 |
1 |
p. v-
1 p.
|
article
|
| 44 |
Distribution of time to failure of consecutive k-out-of-n: F systems
|
|
|
1991
|
31 |
1 |
p. 204-
1 p.
|
article
|
| 45 |
Editorial Board
|
|
|
1991
|
31 |
1 |
p. IFC-
1 p.
|
article
|
| 46 |
Effect of mold compound components on moisture-induced degradation of gold-aluminum bonds in epoxy encapsulated devices
|
|
|
1991
|
31 |
1 |
p. 202-
1 p.
|
article
|
| 47 |
Effect of nitrogen ion bombardment at copper-alumina interface
|
|
|
1991
|
31 |
1 |
p. 211-
1 p.
|
article
|
| 48 |
Effects of dust on various lubricated sliding contacts
|
|
|
1991
|
31 |
1 |
p. 200-
1 p.
|
article
|
| 49 |
EPAS: an emitter piloting advisory expert system for IC emitter deposition
|
|
|
1991
|
31 |
1 |
p. 209-
1 p.
|
article
|
| 50 |
Error analysis for optimal design of accelerated tests
|
|
|
1991
|
31 |
1 |
p. 206-
1 p.
|
article
|
| 51 |
Estimation and predictive density for the generalized logistic distribution
|
Ragab, Aisha
|
|
1991
|
31 |
1 |
p. 91-95
5 p.
|
article
|
| 52 |
Estimation of reliability in multi-component stress-strength model following a Burr distribution
|
Pandey, M.
|
|
1991
|
31 |
1 |
p. 21-25
5 p.
|
article
|
| 53 |
Estimation of scale parameters for two exponential distributions
|
|
|
1991
|
31 |
1 |
p. 203-
1 p.
|
article
|
| 54 |
Estimation of thin-oxide reliablity using proportional hazards models
|
|
|
1991
|
31 |
1 |
p. 210-
1 p.
|
article
|
| 55 |
Etch diagnostics for new III–V and other semiconductors
|
|
|
1991
|
31 |
1 |
p. 208-
1 p.
|
article
|
| 56 |
Evaluating the reliability of reparable systems
|
|
|
1991
|
31 |
1 |
p. 207-
1 p.
|
article
|
| 57 |
Evaluation of optimal-reliability indices for electrical distribution systems
|
|
|
1991
|
31 |
1 |
p. 203-
1 p.
|
article
|
| 58 |
Evaluation of polyimides as dielectric materials for multichip packages with multilevel interconnection structure
|
|
|
1991
|
31 |
1 |
p. 209-
1 p.
|
article
|
| 59 |
Evolution of VLSI reliability engineering
|
|
|
1991
|
31 |
1 |
p. 207-
1 p.
|
article
|
| 60 |
Expert systems maintainability
|
|
|
1991
|
31 |
1 |
p. 206-
1 p.
|
article
|
| 61 |
Fault-simulation programs for integrated-circuit yield estimations
|
|
|
1991
|
31 |
1 |
p. 209-
1 p.
|
article
|
| 62 |
Fault-tolerant hypercube multiprocessors
|
|
|
1991
|
31 |
1 |
p. 203-
1 p.
|
article
|
| 63 |
Fault-tolerant microprocessor-based overcurrent relays
|
Manzoul, Mahmoud A.
|
|
1991
|
31 |
1 |
p. 133-139
7 p.
|
article
|
| 64 |
Formulation of the drift reliability optimization problem
|
Styblinski, M.A.
|
|
1991
|
31 |
1 |
p. 159-171
13 p.
|
article
|
| 65 |
Fuzzy weighted-checklist with linguistic variables
|
|
|
1991
|
31 |
1 |
p. 207-
1 p.
|
article
|
| 66 |
Gallium arsenide finds a new niche
|
|
|
1991
|
31 |
1 |
p. 207-
1 p.
|
article
|
| 67 |
Generalized availability measures for reparable systems with preparation time for repair
|
Butani, N.L.
|
|
1991
|
31 |
1 |
p. 43-46
4 p.
|
article
|
| 68 |
Hot-carrier reliability of bipolar transistors
|
|
|
1991
|
31 |
1 |
p. 201-
1 p.
|
article
|
| 69 |
Human dependability requirements, scope and implementation at the European Space Agency
|
|
|
1991
|
31 |
1 |
p. 199-
1 p.
|
article
|
| 70 |
4891586 IC grabber probe
|
Leber, David
|
|
1991
|
31 |
1 |
p. ii-iii
nvt p.
|
article
|
| 71 |
Importance and sensitivity analysis in assessing system reliability
|
|
|
1991
|
31 |
1 |
p. 206-
1 p.
|
article
|
| 72 |
4907065 Integrated circuit chip sealing assembly
|
Sahakian, VahakK
|
|
1991
|
31 |
1 |
p. vii-
1 p.
|
article
|
| 73 |
4903111 Integrated circuit device
|
Takemae, Yoshihir
|
|
1991
|
31 |
1 |
p. v-
1 p.
|
article
|
| 74 |
Integrating CAM and process simulation to enhance online analysis and control of IC fabrication
|
|
|
1991
|
31 |
1 |
p. 208-
1 p.
|
article
|
| 75 |
Internal friction: a fast technique for electromigration failure analysis
|
|
|
1991
|
31 |
1 |
p. 201-
1 p.
|
article
|
| 76 |
Ion-assisted processing of GaAs for optical devices
|
|
|
1991
|
31 |
1 |
p. 211-
1 p.
|
article
|
| 77 |
Local characterization of ultrathin oxides on silicon wafers by scanning tunneling microscopy
|
|
|
1991
|
31 |
1 |
p. 210-
1 p.
|
article
|
| 78 |
Long-haul undersea communications systems: hardware redundancy techniques for ultra-reliability
|
|
|
1991
|
31 |
1 |
p. 207-
1 p.
|
article
|
| 79 |
4894708 LSI package having a multilayer ceramic substrate
|
Watari, Toshihik
|
|
1991
|
31 |
1 |
p. iv-
1 p.
|
article
|
| 80 |
Markov model for k-out-of-n:G systems with built-in-test
|
Shao, Jiajun
|
|
1991
|
31 |
1 |
p. 123-131
9 p.
|
article
|
| 81 |
4906326 Mask repair system
|
Amemiya, Mitsuak
|
|
1991
|
31 |
1 |
p. vi-
1 p.
|
article
|
| 82 |
Measurement of three dimensional stress and modeling of stress induced migration failure in aluminum interconnects
|
|
|
1991
|
31 |
1 |
p. 201-
1 p.
|
article
|
| 83 |
4894605 Method and on-chip apparatus for continuity testing
|
Ringleb, Diethelm
|
|
1991
|
31 |
1 |
p. iii-iv
nvt p.
|
article
|
| 84 |
4903267 Method of generating test data
|
Arai, Kiyokazu
|
|
1991
|
31 |
1 |
p. vi-
1 p.
|
article
|
| 85 |
4903199 Method of increasing the speed of test program execution for testing electrical characteristics of integrated circuits
|
Russ Keenan, W
|
|
1991
|
31 |
1 |
p. v-vi
nvt p.
|
article
|
| 86 |
4902632 Method of preventing superficial electrical discharges in chips of semiconductor devices during testing
|
Oliveri, Carmel
|
|
1991
|
31 |
1 |
p. v-
1 p.
|
article
|
| 87 |
Microelectronics reliability predictions derived from component defect densities
|
|
|
1991
|
31 |
1 |
p. 201-
1 p.
|
article
|
| 88 |
Microprocessor interfacing
|
G.W.A.D.,
|
|
1991
|
31 |
1 |
p. 191-
1 p.
|
article
|
| 89 |
Microvoids and defect chemistry at the Si-SiO2 interface studied by positron annihilation depth profiling
|
|
|
1991
|
31 |
1 |
p. 210-
1 p.
|
article
|
| 90 |
4891585 Multiple lead probe for integrated circuits in wafer form
|
Janko, Bozidar
|
|
1991
|
31 |
1 |
p. ii-
1 p.
|
article
|
| 91 |
Neural network realization of Markov reliability and fault-tolerance models
|
Suliman, Mamoun
|
|
1991
|
31 |
1 |
p. 141-147
7 p.
|
article
|
| 92 |
New directions in electrical testing of PCBs for the 1990s
|
|
|
1991
|
31 |
1 |
p. 200-
1 p.
|
article
|
| 93 |
Nonparametric Bayes estimation of the survival function and failure rate from record-breaking data
|
Tiwari, Ram C.
|
|
1991
|
31 |
1 |
p. 149-157
9 p.
|
article
|
| 94 |
On measures of importance for components in multistate coherent systems
|
Abouammoh, A.M.
|
|
1991
|
31 |
1 |
p. 109-122
14 p.
|
article
|
| 95 |
On the utilization analysis of a two-stage transfer line production system subject to inter-stage inspection and initial buffer
|
Gopalan, M.N.
|
|
1991
|
31 |
1 |
p. 59-64
6 p.
|
article
|
| 96 |
Optimal low-frequency noise criteria used as a reliability test for BJTs and experimental results
|
Dai, Yisong
|
|
1991
|
31 |
1 |
p. 75-78
4 p.
|
article
|
| 97 |
Optimal testing-policies for intermittent faults
|
|
|
1991
|
31 |
1 |
p. 203-
1 p.
|
article
|
| 98 |
Optimization limits in improving system reliability
|
|
|
1991
|
31 |
1 |
p. 204-
1 p.
|
article
|
| 99 |
Optimum release policy for an inflection s-shaped software reliability growth model
|
Kapur, P.K.
|
|
1991
|
31 |
1 |
p. 39-41
3 p.
|
article
|
| 100 |
Parameter compatibility relations for accelerated testing
|
|
|
1991
|
31 |
1 |
p. 204-205
2 p.
|
article
|
| 101 |
Partial factoring: an efficient algorithm for approximating 2-terminal reliability on complete graphs
|
|
|
1991
|
31 |
1 |
p. 204-
1 p.
|
article
|
| 102 |
Particles on surfaces 2 detection, adhesion, and removal
|
G.W.A.D.,
|
|
1991
|
31 |
1 |
p. 190-191
2 p.
|
article
|
| 103 |
Performability of the hypercube
|
|
|
1991
|
31 |
1 |
p. 203-
1 p.
|
article
|
| 104 |
Pi-factors revisited
|
|
|
1991
|
31 |
1 |
p. 206-
1 p.
|
article
|
| 105 |
PLISD: a new high-vacuum sputtering technique for thin film deposition
|
|
|
1991
|
31 |
1 |
p. 210-
1 p.
|
article
|
| 106 |
Prediction limits for an exponential distribution: a Bayes predictive distribution approach
|
|
|
1991
|
31 |
1 |
p. 205-
1 p.
|
article
|
| 107 |
4894114 Process for producing VIAS in semiconductor
|
Nathanson, HarveyC
|
|
1991
|
31 |
1 |
p. iii-
1 p.
|
article
|
| 108 |
Profit analysis of a two multi-component unit standby system with MRT
|
Gupta, Rakesh
|
|
1991
|
31 |
1 |
p. 7-10
4 p.
|
article
|
| 109 |
Profit analysis of a two-unit cold standby system with abnormal weather condition
|
Gupta, Rakesh
|
|
1991
|
31 |
1 |
p. 1-5
5 p.
|
article
|
| 110 |
Properties of the MLE for parameters of a Weibull regression model under Type I censoring
|
|
|
1991
|
31 |
1 |
p. 203-
1 p.
|
article
|
| 111 |
Publications, notices, calls for papers, etc.
|
|
|
1991
|
31 |
1 |
p. 197-198
2 p.
|
article
|
| 112 |
Qualifying of chip bonding operations in the process of fabrication of bipolar transistors by means of noise measurements in the low-frequency range
|
|
|
1991
|
31 |
1 |
p. 208-
1 p.
|
article
|
| 113 |
Rapid formation of ultra-thin dielectrics by Si surface modification using a large area low energy electron beam
|
|
|
1991
|
31 |
1 |
p. 211-
1 p.
|
article
|
| 114 |
Reliability analysis in the presence of chance common cause shock failures
|
Chari, A.A.
|
|
1991
|
31 |
1 |
p. 15-19
5 p.
|
article
|
| 115 |
Reliability assurance of application-specific microelectronic circuits
|
|
|
1991
|
31 |
1 |
p. 205-
1 p.
|
article
|
| 116 |
Reliability improvement of power inverters through environmental stress simulation
|
|
|
1991
|
31 |
1 |
p. 201-
1 p.
|
article
|
| 117 |
Reliability of directed networks using the factoring theorem
|
|
|
1991
|
31 |
1 |
p. 205-
1 p.
|
article
|
| 118 |
Reliability of hot water solar systems in Greece
|
|
|
1991
|
31 |
1 |
p. 204-
1 p.
|
article
|
| 119 |
Reliability of optoelectronic devices for fiber optic communications
|
|
|
1991
|
31 |
1 |
p. 201-
1 p.
|
article
|
| 120 |
Reliability study on polycrystalline silicon thin film resistors used in LSIs under thermal and electrical stress
|
|
|
1991
|
31 |
1 |
p. 211-
1 p.
|
article
|
| 121 |
Replacement policies for a cumulative damage model with minimal repair at failure
|
|
|
1991
|
31 |
1 |
p. 205-
1 p.
|
article
|
| 122 |
4891684 Semiconductor device
|
Nishioka, Yasushiro
|
|
1991
|
31 |
1 |
p. iii-
1 p.
|
article
|
| 123 |
4881029 Semiconductor integrated circuit devices and methods for testing same
|
Kawamura, Masahiko
|
|
1991
|
31 |
1 |
p. i-
1 p.
|
article
|
| 124 |
4890148 Semiconductor memory cell device with thick insulative layer
|
Ikeda, Shuji
|
|
1991
|
31 |
1 |
p. ii-
1 p.
|
article
|
| 125 |
4897817 Semiconductor memory device with a built-in test circuit
|
Katanosaka, Naoki
|
|
1991
|
31 |
1 |
p. iv-
1 p.
|
article
|
| 126 |
Silicon-on-insulator: materials aspects and technological applications
|
|
|
1991
|
31 |
1 |
p. 208-
1 p.
|
article
|
| 127 |
Simulation at the register transfer level as a method of investigation of VLSI integrated circuits
|
|
|
1991
|
31 |
1 |
p. 201-
1 p.
|
article
|
| 128 |
Simulation of transients in VLSI packaging interconnections
|
|
|
1991
|
31 |
1 |
p. 209-
1 p.
|
article
|
| 129 |
Smooth nonparametric estimation of mean residual life
|
Kulasekera, K.B.
|
|
1991
|
31 |
1 |
p. 97-108
12 p.
|
article
|
| 130 |
Society of reliability engineers bulletin
|
Reiche, Hans
|
|
1991
|
31 |
1 |
p. 187-
1 p.
|
article
|
| 131 |
Software-reliability evaluation of the TROPICO-R switching system
|
|
|
1991
|
31 |
1 |
p. 202-
1 p.
|
article
|
| 132 |
Stochastic behaviour of a two-unit system with two types of repairman and subject to random inspection
|
Tuteja, R.K.
|
|
1991
|
31 |
1 |
p. 79-83
5 p.
|
article
|
| 133 |
Stochastic models for mission effectiveness
|
|
|
1991
|
31 |
1 |
p. 202-
1 p.
|
article
|
| 134 |
Stress screening of electronic modules: investigation of effects of temperature rate of change
|
|
|
1991
|
31 |
1 |
p. 202-
1 p.
|
article
|
| 135 |
4906921 Structure and process for testing integrated circuits permitting determination of the properties of layers
|
Juge, Andre
|
|
1991
|
31 |
1 |
p. vii-
1 p.
|
article
|
| 136 |
Temperature-cycling acceleration factors for aluminum metallization failure in VLSI applications
|
|
|
1991
|
31 |
1 |
p. 202-
1 p.
|
article
|
| 137 |
4881229 Test circuit arrangement for a communication network and test method using same
|
Kaltbeitzel, Gunter
|
|
1991
|
31 |
1 |
p. i-
1 p.
|
article
|
| 138 |
4896108 Test circuit for measuring specific contact resistivity of self-aligned contacts in integrated circuits
|
Lynch, WilliamT
|
|
1991
|
31 |
1 |
p. iv-
1 p.
|
article
|
| 139 |
4904934 Testing apparatus for semiconductor devices
|
Nishihashi, Ryouj
|
|
1991
|
31 |
1 |
p. vi-
1 p.
|
article
|
| 140 |
Test of amorphous silicon solar cells: Characteristics degradation due to exposure to intermittent light at several constant ambient temperatures and the validity of the test method
|
Yanagisawa, T.
|
|
1991
|
31 |
1 |
p. 173-184
12 p.
|
article
|
| 141 |
The effects of defects on the early failure of metal interconnects
|
|
|
1991
|
31 |
1 |
p. 200-
1 p.
|
article
|
| 142 |
The effects of sample distance on Al-film structure when using magnetron sputtering ion-plating
|
|
|
1991
|
31 |
1 |
p. 211-
1 p.
|
article
|
| 143 |
The electrical resistance ratio (RR) as a thin film metal monitor
|
|
|
1991
|
31 |
1 |
p. 210-
1 p.
|
article
|
| 144 |
The harmfulness of blowholes in PTH soldered assemblies
|
|
|
1991
|
31 |
1 |
p. 201-
1 p.
|
article
|
| 145 |
The influence of fault occurrence on multiaccess system throughput
|
Jòz̀wiak, Ireneusz J.
|
|
1991
|
31 |
1 |
p. 65-69
5 p.
|
article
|
| 146 |
The NASA trend analysis program
|
|
|
1991
|
31 |
1 |
p. 199-
1 p.
|
article
|
| 147 |
Thermal breakdown of VLSI by ESD pulses
|
|
|
1991
|
31 |
1 |
p. 201-202
2 p.
|
article
|
| 148 |
Thermal stress analysis of tape automated bonding packages and interconnections
|
|
|
1991
|
31 |
1 |
p. 208-
1 p.
|
article
|
| 149 |
The use and evaluation of yield models in integrated circuit manufacturing
|
|
|
1991
|
31 |
1 |
p. 209-
1 p.
|
article
|
| 150 |
4899055 Thin film thickness measuring method
|
Adams, Arnol
|
|
1991
|
31 |
1 |
p. iv-v
nvt p.
|
article
|
| 151 |
Timing analysis forestalls failures in digital circuits
|
|
|
1991
|
31 |
1 |
p. 207-
1 p.
|
article
|
| 152 |
Two-unit redundant system with inspection and adjustable rates
|
Goel, L.R.
|
|
1991
|
31 |
1 |
p. 11-14
4 p.
|
article
|
| 153 |
Use of advanced analytical techniques for VLSI failure analysis
|
|
|
1991
|
31 |
1 |
p. 206-
1 p.
|
article
|
| 154 |
Using test data to predict avionics integrity
|
|
|
1991
|
31 |
1 |
p. 206-
1 p.
|
article
|
| 155 |
Very thin oxides in VLSI technology: properties and device implications
|
|
|
1991
|
31 |
1 |
p. 209-
1 p.
|
article
|
| 156 |
Visual inspection of surface-mounted solder joints
|
|
|
1991
|
31 |
1 |
p. 200-201
2 p.
|
article
|
| 157 |
VLSI reliability
|
G.W.A.D.,
|
|
1991
|
31 |
1 |
p. 189-190
2 p.
|
article
|
Journal description