| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A CMOS/buried-n-channel CCD compatible process for analog signal processing applications
|
|
|
1978
|
17 |
4 |
p. 422-
1 p.
|
artikel
|
| 2 |
A comparison of simple and numerical two-dimensional modesla for the threshold voltage of short channel MOSTS
|
|
|
1978
|
17 |
4 |
p. 423-424
2 p.
|
artikel
|
| 3 |
A complete microcomputer on a chip
|
|
|
1978
|
17 |
4 |
p. 423-
1 p.
|
artikel
|
| 4 |
A-d converter chip resolves 10 bits
|
|
|
1978
|
17 |
4 |
p. 421-
1 p.
|
artikel
|
| 5 |
A decomposition method for computing system reliability by a Boolean expression
|
|
|
1978
|
17 |
4 |
p. 418-
1 p.
|
artikel
|
| 6 |
Adhesion measurements of metallizations for hybrid microcircuits
|
|
|
1978
|
17 |
4 |
p. 427-
1 p.
|
artikel
|
| 7 |
Ageing tests on microwave integrated circuits
|
|
|
1978
|
17 |
4 |
p. 414-
1 p.
|
artikel
|
| 8 |
Allocation of test effort for minimum variance of reliability
|
|
|
1978
|
17 |
4 |
p. 417-
1 p.
|
artikel
|
| 9 |
Alloy element additions to gold thick film conductors: effects on indium/lead soldering and ultrasonic aluminum wire bonding
|
|
|
1978
|
17 |
4 |
p. 426-427
2 p.
|
artikel
|
| 10 |
All-tantalum wet-slug capacitor overcomes catastrophic failure
|
|
|
1978
|
17 |
4 |
p. 413-
1 p.
|
artikel
|
| 11 |
Analog 1/0 hybrids simplify microprocessor interlaces
|
|
|
1978
|
17 |
4 |
p. 426-
1 p.
|
artikel
|
| 12 |
Analysis of non-catastrophic failures in electronic devices due to random noise
|
|
|
1978
|
17 |
4 |
p. 418-
1 p.
|
artikel
|
| 13 |
Analysis of superposition errors in wafer fabrication
|
|
|
1978
|
17 |
4 |
p. 422-
1 p.
|
artikel
|
| 14 |
An analysis of diffusion process control
|
|
|
1978
|
17 |
4 |
p. 420-
1 p.
|
artikel
|
| 15 |
A new 96 percent improved alumina substrate
|
|
|
1978
|
17 |
4 |
p. 426-
1 p.
|
artikel
|
| 16 |
An ion implanted bipolar silicon integrated circuit process
|
|
|
1978
|
17 |
4 |
p. 428-
1 p.
|
artikel
|
| 17 |
An optimal decision rule for repair vs replacement
|
|
|
1978
|
17 |
4 |
p. 417-
1 p.
|
artikel
|
| 18 |
A reduction technique for obtaining a simplified reliability expression
|
|
|
1978
|
17 |
4 |
p. 418-
1 p.
|
artikel
|
| 19 |
A study of the reliability of microwave transistors
|
|
|
1978
|
17 |
4 |
p. 413-414
2 p.
|
artikel
|
| 20 |
A test approach for commercial communication satellites
|
|
|
1978
|
17 |
4 |
p. 419-
1 p.
|
artikel
|
| 21 |
Automatic registration in an electron-beam lithographic system
|
|
|
1978
|
17 |
4 |
p. 429-
1 p.
|
artikel
|
| 22 |
Availability of a certain item within a system
|
|
|
1978
|
17 |
4 |
p. 418-419
2 p.
|
artikel
|
| 23 |
Availability prediction by using a method of simulation
|
|
|
1978
|
17 |
4 |
p. 419-
1 p.
|
artikel
|
| 24 |
A variance minimization method of reliability design
|
|
|
1978
|
17 |
4 |
p. 417-
1 p.
|
artikel
|
| 25 |
Bubble memory as small mass storage
|
|
|
1978
|
17 |
4 |
p. 422-423
2 p.
|
artikel
|
| 26 |
Calculating the cost of testing LSI chips
|
|
|
1978
|
17 |
4 |
p. 419-420
2 p.
|
artikel
|
| 27 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1978
|
17 |
4 |
p. 405-407
3 p.
|
artikel
|
| 28 |
CALHYM: A computer program for the automatic layout of large digital hybrid microcircuits
|
|
|
1978
|
17 |
4 |
p. 422-
1 p.
|
artikel
|
| 29 |
Capacitors of thin insulating films of photoresist materials
|
Singh, Awatar
|
|
1978
|
17 |
4 |
p. 441-444
4 p.
|
artikel
|
| 30 |
Capture cross-section of excitons on neutral indium impurities in silicon
|
|
|
1978
|
17 |
4 |
p. 425-
1 p.
|
artikel
|
| 31 |
Characterization of properties of nickel in silicon using thermally stimulated capacitance method
|
|
|
1978
|
17 |
4 |
p. 425-
1 p.
|
artikel
|
| 32 |
Chip carriers are making inroads
|
|
|
1978
|
17 |
4 |
p. 420-
1 p.
|
artikel
|
| 33 |
Combined environment reliability test (CERT)
|
|
|
1978
|
17 |
4 |
p. 417-
1 p.
|
artikel
|
| 34 |
Comparison of arc erosive and laser beam trimming of thin film resistors
|
|
|
1978
|
17 |
4 |
p. 426-
1 p.
|
artikel
|
| 35 |
Component reliability exposed to thermal neutron environment—I
|
|
|
1978
|
17 |
4 |
p. 415-
1 p.
|
artikel
|
| 36 |
Component reliability exposed to thermal neutron environment—II
|
|
|
1978
|
17 |
4 |
p. 415-
1 p.
|
artikel
|
| 37 |
Component reliability exposed to thermal neutron environment—III
|
|
|
1978
|
17 |
4 |
p. 415-
1 p.
|
artikel
|
| 38 |
Corona discharge—electrostatic method for deposition of powdered passivation glass on semiconductor devices
|
|
|
1978
|
17 |
4 |
p. 420-421
2 p.
|
artikel
|
| 39 |
Correction of nonlinear deflection distortion in a direct exposure electron-beam system
|
|
|
1978
|
17 |
4 |
p. 428-
1 p.
|
artikel
|
| 40 |
Cost model for testing program based on nonhomogeneous poisson failure model
|
|
|
1978
|
17 |
4 |
p. 416-
1 p.
|
artikel
|
| 41 |
Criteria of low-noise thick-film resistors
|
|
|
1978
|
17 |
4 |
p. 426-
1 p.
|
artikel
|
| 42 |
Crystal growth by molecular beam epitaxy
|
|
|
1978
|
17 |
4 |
p. 428-
1 p.
|
artikel
|
| 43 |
Decision making in reliability
|
|
|
1978
|
17 |
4 |
p. 416-
1 p.
|
artikel
|
| 44 |
Determination of gold concentration and the effective impurity doping at the silicon/silicon-dioxide interface
|
|
|
1978
|
17 |
4 |
p. 423-
1 p.
|
artikel
|
| 45 |
Effect of substrate bias on properties of rf-sputtered Cr-SiO films
|
|
|
1978
|
17 |
4 |
p. 426-
1 p.
|
artikel
|
| 46 |
Effects of electrostatic discharge on linear bipolar integrated circuits
|
|
|
1978
|
17 |
4 |
p. 416-
1 p.
|
artikel
|
| 47 |
Electron optics of an electron-beam lithographic system
|
|
|
1978
|
17 |
4 |
p. 428-
1 p.
|
artikel
|
| 48 |
Etude d'un bloc de calcul a CCD pour le traitement numerique du signal
|
|
|
1978
|
17 |
4 |
p. 422-
1 p.
|
artikel
|
| 49 |
Experimental evidence against the shell model of bound multiexciton complexes in silicon
|
|
|
1978
|
17 |
4 |
p. 425-
1 p.
|
artikel
|
| 50 |
Factors affecting laser-trim stability of thick film resistors
|
|
|
1978
|
17 |
4 |
p. 427-
1 p.
|
artikel
|
| 51 |
Factors governing aluminium interconnection corrosion in plastic encapsulated microelectronic devices
|
|
|
1978
|
17 |
4 |
p. 415-
1 p.
|
artikel
|
| 52 |
Failure-rate as a function of time due to lognormal life distribution(s) of weak parts
|
|
|
1978
|
17 |
4 |
p. 419-
1 p.
|
artikel
|
| 53 |
Gate protection for CMOS/SOS
|
|
|
1978
|
17 |
4 |
p. 415-416
2 p.
|
artikel
|
| 54 |
Green's function calculating of electric fields in surface-channel charge-coupled devices
|
|
|
1978
|
17 |
4 |
p. 423-
1 p.
|
artikel
|
| 55 |
High-pressure pyrogenic oxidation in the production environment
|
|
|
1978
|
17 |
4 |
p. 421-
1 p.
|
artikel
|
| 56 |
Hot-electron emission from silicon into silicon dioxide
|
|
|
1978
|
17 |
4 |
p. 425-426
2 p.
|
artikel
|
| 57 |
Impact of the frequency of technician visits on facility failure rate
|
|
|
1978
|
17 |
4 |
p. 417-418
2 p.
|
artikel
|
| 58 |
Improved hybrid circuit assembly yields and reliability by glassivation of the semiconductor chip
|
|
|
1978
|
17 |
4 |
p. 413-
1 p.
|
artikel
|
| 59 |
Industry standard for B-Series CMOS
|
|
|
1978
|
17 |
4 |
p. 420-
1 p.
|
artikel
|
| 60 |
Influence of interface charge inhomogeneities on the measurement of surface state densities in Si-SiO2 interfaces by means of the MOS a.c. conductance technique
|
|
|
1978
|
17 |
4 |
p. 424-425
2 p.
|
artikel
|
| 61 |
Influence of the metal migration from screen-and-fired terminations on the electrical characteristics of thick-film resistors
|
|
|
1978
|
17 |
4 |
p. 427-
1 p.
|
artikel
|
| 62 |
Integrated circuits for data transmission
|
|
|
1978
|
17 |
4 |
p. 422-
1 p.
|
artikel
|
| 63 |
Ion implantation for semiconductor devices
|
|
|
1978
|
17 |
4 |
p. 429-
1 p.
|
artikel
|
| 64 |
Ion milling for semiconductor production processes
|
|
|
1978
|
17 |
4 |
p. 429-
1 p.
|
artikel
|
| 65 |
Japanese laboratory is growing 5-in.-diameter ingots
|
|
|
1978
|
17 |
4 |
p. 421-
1 p.
|
artikel
|
| 66 |
65-k RAMs won't slight performance
|
|
|
1978
|
17 |
4 |
p. 422-
1 p.
|
artikel
|
| 67 |
Literature survey on three-state device reliability systems
|
|
|
1978
|
17 |
4 |
p. 413-
1 p.
|
artikel
|
| 68 |
Low frequency noise measurements on silicon-on-sapphire (SOS) MOS transistors
|
|
|
1978
|
17 |
4 |
p. 424-
1 p.
|
artikel
|
| 69 |
LSI: the testing nightmare
|
|
|
1978
|
17 |
4 |
p. 418-
1 p.
|
artikel
|
| 70 |
Magnetic fields and the stability of charge-density—wave ground-states in silicon inversion layers
|
|
|
1978
|
17 |
4 |
p. 425-
1 p.
|
artikel
|
| 71 |
Masks for printing thick-film circuits
|
|
|
1978
|
17 |
4 |
p. 426-
1 p.
|
artikel
|
| 72 |
Maximum reliability route subject to k-improvements in a directed network
|
|
|
1978
|
17 |
4 |
p. 417-
1 p.
|
artikel
|
| 73 |
Memory makers brace for bubble battle
|
|
|
1978
|
17 |
4 |
p. 420-
1 p.
|
artikel
|
| 74 |
8086 microcomputer bridges the gap between 8- and 16-bit designs
|
|
|
1978
|
17 |
4 |
p. 423-
1 p.
|
artikel
|
| 75 |
Microprocessor analysers in the development and support of microprocessor based systems
|
|
|
1978
|
17 |
4 |
p. 421-
1 p.
|
artikel
|
| 76 |
Microscopic techniques in the analysis of mechanical failures
|
|
|
1978
|
17 |
4 |
p. 414-
1 p.
|
artikel
|
| 77 |
Modern physics brings semiconductor technology to a turning point
|
|
|
1978
|
17 |
4 |
p. 420-
1 p.
|
artikel
|
| 78 |
Morphology and electrical parameters of MOS microelectronics circuits
|
|
|
1978
|
17 |
4 |
p. 420-
1 p.
|
artikel
|
| 79 |
Mospower—the challenge to power bipolars
|
|
|
1978
|
17 |
4 |
p. 420-
1 p.
|
artikel
|
| 80 |
Multiobjective reliability and redundancy optimization of a series-parallel system by the Surrogate Worth Trade-off method
|
Sakawa, Masatoshi
|
|
1978
|
17 |
4 |
p. 465-467
3 p.
|
artikel
|
| 81 |
Negative differential resistance in (100) n-channel silicon inversion layers
|
|
|
1978
|
17 |
4 |
p. 426-
1 p.
|
artikel
|
| 82 |
New analogue component concepts for digital processing systems
|
|
|
1978
|
17 |
4 |
p. 421-422
2 p.
|
artikel
|
| 83 |
New reaction kinetic aspects of thermal oxidation of sputtered tantalum (nitride) layers
|
|
|
1978
|
17 |
4 |
p. 427-
1 p.
|
artikel
|
| 84 |
Noise injection as a measure of semiconductor component performance and degradation
|
|
|
1978
|
17 |
4 |
p. 414-
1 p.
|
artikel
|
| 85 |
One chip controllers and 4-K static rams star
|
|
|
1978
|
17 |
4 |
p. 422-
1 p.
|
artikel
|
| 86 |
On the temperature dependent cyclotron resonance lineshape of inversion-layer electrons in Si
|
|
|
1978
|
17 |
4 |
p. 425-
1 p.
|
artikel
|
| 87 |
Optimal placement of spare modules in a cascaded chain
|
|
|
1978
|
17 |
4 |
p. 419-
1 p.
|
artikel
|
| 88 |
Optimal replacement rate of devices with lognormal failure distributions
|
|
|
1978
|
17 |
4 |
p. 416-417
2 p.
|
artikel
|
| 89 |
Optimal selection of sequential tests for reliability
|
|
|
1978
|
17 |
4 |
p. 417-
1 p.
|
artikel
|
| 90 |
Optimisation of thin and thick film technology for hybrid microwave circuits
|
|
|
1978
|
17 |
4 |
p. 428-
1 p.
|
artikel
|
| 91 |
Optimum number of checks in checking policy
|
|
|
1978
|
17 |
4 |
p. 419-
1 p.
|
artikel
|
| 92 |
Optimum redundancy of repairable modules
|
|
|
1978
|
17 |
4 |
p. 418-
1 p.
|
artikel
|
| 93 |
Origin and effects of negative ions in the sputtering of intermetallic compounds
|
|
|
1978
|
17 |
4 |
p. 427-428
2 p.
|
artikel
|
| 94 |
Oscillators for use in integrated microwave technique
|
|
|
1978
|
17 |
4 |
p. 422-
1 p.
|
artikel
|
| 95 |
Plasma process development and monitoring via mass spectrometry
|
|
|
1978
|
17 |
4 |
p. 421-
1 p.
|
artikel
|
| 96 |
Plastic encapsulated semiconductor devices—A bibliography
|
|
|
1978
|
17 |
4 |
p. 419-
1 p.
|
artikel
|
| 97 |
Powerful LSI devices bow at silver anniversary (Solid State Circuits Conference, San Francisco)
|
|
|
1978
|
17 |
4 |
p. 423-
1 p.
|
artikel
|
| 98 |
Probability of displacement damage in a component exposed to nuclear radiation stress from the viewpoint of reliability
|
Lal, Krishan
|
|
1978
|
17 |
4 |
p. 435-439
5 p.
|
artikel
|
| 99 |
Prognostication of drift failures
|
|
|
1978
|
17 |
4 |
p. 413-
1 p.
|
artikel
|
| 100 |
Prospects for GaAs mosfet integration
|
|
|
1978
|
17 |
4 |
p. 421-
1 p.
|
artikel
|
| 101 |
Queuing models for estimating aircraft fleet availability
|
|
|
1978
|
17 |
4 |
p. 416-
1 p.
|
artikel
|
| 102 |
Random point processes applied to availability analysis of redundant systems with repair
|
|
|
1978
|
17 |
4 |
p. 418-
1 p.
|
artikel
|
| 103 |
Reactive sputtering of NiCr resistors with closely adjustable temperature coefficient of resistance
|
|
|
1978
|
17 |
4 |
p. 427-
1 p.
|
artikel
|
| 104 |
Recent patents on microelectronics
|
|
|
1978
|
17 |
4 |
p. 409-412
4 p.
|
artikel
|
| 105 |
Reduced gold-plating on copper leads for thermocompression bonding—Part I—Initial characterization
|
|
|
1978
|
17 |
4 |
p. 421-
1 p.
|
artikel
|
| 106 |
Reed switch reliability
|
Saraf, R.K.
|
|
1978
|
17 |
4 |
p. 431-433
3 p.
|
artikel
|
| 107 |
Reliability analysis of standby repairable systems when an emergency occurs
|
Nakagawa, T.
|
|
1978
|
17 |
4 |
p. 461-464
4 p.
|
artikel
|
| 108 |
Reliability growth apportionment
|
|
|
1978
|
17 |
4 |
p. 416-
1 p.
|
artikel
|
| 109 |
Reliability improvement by redundancy voting in analogue electronic systems
|
|
|
1978
|
17 |
4 |
p. 419-
1 p.
|
artikel
|
| 110 |
Reliability study of wire bonds to silver plated surfaces
|
|
|
1978
|
17 |
4 |
p. 415-
1 p.
|
artikel
|
| 111 |
Reliability testing of BAC hybrid circuits
|
|
|
1978
|
17 |
4 |
p. 414-
1 p.
|
artikel
|
| 112 |
Remarks on wire and die bonding for hybrid circuits
|
|
|
1978
|
17 |
4 |
p. 426-
1 p.
|
artikel
|
| 113 |
Resistivity of phosphorus-doped sputter-deposited polycrystalline silicon films
|
|
|
1978
|
17 |
4 |
p. 424-
1 p.
|
artikel
|
| 114 |
Review of experimental aspects of hot electron transport in MOS structures
|
|
|
1978
|
17 |
4 |
p. 425-
1 p.
|
artikel
|
| 115 |
RIW with cost sharing
|
|
|
1978
|
17 |
4 |
p. 417-
1 p.
|
artikel
|
| 116 |
Role of assurance technologies in M-PRT evaluation
|
|
|
1978
|
17 |
4 |
p. 417-
1 p.
|
artikel
|
| 117 |
Sample-hold chip delivers precision
|
|
|
1978
|
17 |
4 |
p. 422-
1 p.
|
artikel
|
| 118 |
Scanning electron-beam system turns out IC wafers fast
|
|
|
1978
|
17 |
4 |
p. 428-
1 p.
|
artikel
|
| 119 |
Selecting the prior distribution in Bayesian estimation
|
|
|
1978
|
17 |
4 |
p. 418-
1 p.
|
artikel
|
| 120 |
Semiconductors: toeing the (microfine) line
|
|
|
1978
|
17 |
4 |
p. 421-
1 p.
|
artikel
|
| 121 |
Sensitivity of Bayes estimates of reciprocal MTBF and reliability to an incorrect failure model
|
|
|
1978
|
17 |
4 |
p. 419-
1 p.
|
artikel
|
| 122 |
Silicon surface emission of hot electrons
|
|
|
1978
|
17 |
4 |
p. 425-
1 p.
|
artikel
|
| 123 |
Simulating maintenance work in an engineering firm: a case study
|
|
|
1978
|
17 |
4 |
p. 418-
1 p.
|
artikel
|
| 124 |
Some experiences and conclusions using soldered and welded packages for hermetic thick film hybrids
|
|
|
1978
|
17 |
4 |
p. 427-
1 p.
|
artikel
|
| 125 |
Statistical methods for estimating variance components for integrated circuits device parameters
|
|
|
1978
|
17 |
4 |
p. 414-
1 p.
|
artikel
|
| 126 |
Studies of second breakdown in silicon diodes
|
|
|
1978
|
17 |
4 |
p. 414-
1 p.
|
artikel
|
| 127 |
Superlinearity in a Bi-implanted CdS thin film
|
|
|
1978
|
17 |
4 |
p. 428-
1 p.
|
artikel
|
| 128 |
Suppression of premature dielectric breakdown for high-voltage capacitance measurements
|
|
|
1978
|
17 |
4 |
p. 414-
1 p.
|
artikel
|
| 129 |
Surface potentials of interacting metallic films
|
|
|
1978
|
17 |
4 |
p. 427-
1 p.
|
artikel
|
| 130 |
Surface quantum oscillations in n-type (100) silicon inversion layers on sapphire
|
|
|
1978
|
17 |
4 |
p. 424-
1 p.
|
artikel
|
| 131 |
System availability and optimum spare units
|
|
|
1978
|
17 |
4 |
p. 416-
1 p.
|
artikel
|
| 132 |
Tests show spotty LSI records
|
|
|
1978
|
17 |
4 |
p. 415-
1 p.
|
artikel
|
| 133 |
The construction and reliability of Schottky diodes
|
Croft, D.C.
|
|
1978
|
17 |
4 |
p. 445-455
11 p.
|
artikel
|
| 134 |
The distributed RC variable-frequency phase-shift oscillator
|
Miller, C.A.
|
|
1978
|
17 |
4 |
p. 457-460
4 p.
|
artikel
|
| 135 |
The effects of trimming on the current noise of thick film resistors
|
|
|
1978
|
17 |
4 |
p. 426-
1 p.
|
artikel
|
| 136 |
The evaluation of CMOS static-charge protection networks and failure mechanisms associated with overstress conditions as related to device life
|
|
|
1978
|
17 |
4 |
p. 415-
1 p.
|
artikel
|
| 137 |
The obsolescence of the microprocessor
|
|
|
1978
|
17 |
4 |
p. 420-
1 p.
|
artikel
|
| 138 |
Theory of switching phenomena in metal/semi-insulator/n-p silicon devices
|
|
|
1978
|
17 |
4 |
p. 424-
1 p.
|
artikel
|
| 139 |
The role of customer Q.A. in reducing hybrid reliability problems
|
|
|
1978
|
17 |
4 |
p. 413-
1 p.
|
artikel
|
| 140 |
Thin-film hybrid circuits
|
|
|
1978
|
17 |
4 |
p. 426-
1 p.
|
artikel
|
| 141 |
Thin film integrated RC-networks with compensated temperature coefficients of R and C
|
|
|
1978
|
17 |
4 |
p. 427-
1 p.
|
artikel
|
| 142 |
Time dependent unavailability analysis of nuclear safety systems
|
|
|
1978
|
17 |
4 |
p. 416-
1 p.
|
artikel
|
| 143 |
Timer IC circuit separates rep rate and duty cycle
|
|
|
1978
|
17 |
4 |
p. 422-
1 p.
|
artikel
|
| 144 |
Transferred electron effects in n-GaAs and n-InP under hydrostatic pressure
|
|
|
1978
|
17 |
4 |
p. 425-
1 p.
|
artikel
|
| 145 |
Transistor gain and diffusion effects
|
|
|
1978
|
17 |
4 |
p. 421-
1 p.
|
artikel
|
| 146 |
Transport of hot carriers in semiconductor quantized inversion layers
|
|
|
1978
|
17 |
4 |
p. 423-
1 p.
|
artikel
|
| 147 |
Une methode de conception rapide et fiable des circuits integres avec controle automatique de l'implantation
|
|
|
1978
|
17 |
4 |
p. 420-
1 p.
|
artikel
|
| 148 |
Une nouvelle technique de croissance epitaxiale de couches ultraminces d'arseniure de gallium par cracking de composes organometalliques sous pression reduite
|
|
|
1978
|
17 |
4 |
p. 423-
1 p.
|
artikel
|
| 149 |
2-Unit redundant systems with replacement and repair
|
|
|
1978
|
17 |
4 |
p. 418-
1 p.
|
artikel
|
| 150 |
Voltage breakdown characteristics of close spaced aluminum arc gap structures on oxidised silicon
|
|
|
1978
|
17 |
4 |
p. 415-
1 p.
|
artikel
|
| 151 |
What to look for in analog input/output boards
|
|
|
1978
|
17 |
4 |
p. 420-
1 p.
|
artikel
|
| 152 |
X-band microwave integrated circuits using slotline and coplanar waveguide
|
|
|
1978
|
17 |
4 |
p. 422-
1 p.
|
artikel
|
Tijdschrift beschrijving