| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
Adhesion strength of die attach film for thin electronic package at elevated temperature
|
Mose, Bruno R.
|
|
2018
|
|
P1 |
p. 15-22
|
article
|
| 2 |
A holistic comparison of the different resampling algorithms for particle filter based prognosis using lithium ion batteries as a case study
|
Pugalenthi, Karkulali
|
|
2018
|
|
P1 |
p. 160-169
|
article
|
| 3 |
Analytical model for the transient analysis of electronic assemblies subjected to impact loading
|
Gharaibeh, Mohammad A.
|
|
2018
|
|
P1 |
p. 112-119
|
article
|
| 4 |
A robust asynchronous 16 × 16-bit subthreshold multiplier using SAPTL technique
|
Zhang, Qi
|
|
2018
|
|
P1 |
p. 98-111
|
article
|
| 5 |
Editorial Board
|
|
|
2018
|
|
P1 |
p. ii
|
article
|
| 6 |
Failure and failure characterization of QFP package interconnect structure under random vibration condition
|
Jiaxing, Hu
|
|
2018
|
|
P1 |
p. 120-127
|
article
|
| 7 |
Heavy ion impact on narrow band cascoded low noise amplifier
|
Rajendiran, P.
|
|
2018
|
|
P1 |
p. 31-37
|
article
|
| 8 |
Implications of electron beam irradiation on Al/n-Si Schottky junction properties
|
Vali, Indudhar Panduranga
|
|
2018
|
|
P1 |
p. 179-184
|
article
|
| 9 |
Lifetime-aware scheduling in high level synthesis
|
Es'haghi, Siavash
|
|
2018
|
|
P1 |
p. 86-97
|
article
|
| 10 |
Methodology of determining the applicability range of the DPL model to heat transfer in modern integrated circuits comprised of FinFETs
|
Zubert, Mariusz
|
|
2018
|
|
P1 |
p. 139-153
|
article
|
| 11 |
Mission profile-based assessment of semiconductor technologies for automotive applications
|
Ahari, Ali
|
|
2018
|
|
P1 |
p. 129-138
|
article
|
| 12 |
New dynamic electro-thermo-optical model of power LEDs
|
Górecki, Krzysztof
|
|
2018
|
|
P1 |
p. 1-7
|
article
|
| 13 |
Performance analysis of S-parameter in N-MOSFET devices after thermal accelerated tests
|
Belaïd, M.A.
|
|
2018
|
|
P1 |
p. 8-14
|
article
|
| 14 |
Seu and Sefi error detection and correction on a ddr3 memory system
|
Cóbreces, Ana
|
|
2018
|
|
P1 |
p. 23-30
|
article
|
| 15 |
Simulation study of single event effects in the SiC LDMOS with a step compound drift region
|
Bao, Meng-tian
|
|
2018
|
|
P1 |
p. 170-178
|
article
|
| 16 |
The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface
|
Chen, Si
|
|
2018
|
|
P1 |
p. 52-66
|
article
|
| 17 |
Thermal reliability investigation of Ag-Sn TLP bonds for high-temperature power electronics application
|
Shao, Huakai
|
|
2018
|
|
P1 |
p. 38-45
|
article
|
| 18 |
The threshold voltage degradation model of N Channel VDMOSFETs under PBT stress
|
Ye, Xuerong
|
|
2018
|
|
P1 |
p. 46-51
|
article
|
| 19 |
To the special issue constructed from the selected papers of Thermal investigations of integrated circuits and systems, THERMINIC'17
|
Codecasa, Lorenzo
|
|
2018
|
|
P1 |
p. 128
|
article
|
| 20 |
Towards reliability enhancement of graphene FET biosensor in complex analyte: Artificial neural network approach
|
Basu, Joyeeta
|
|
2018
|
|
P1 |
p. 154-159
|
article
|
| 21 |
Validation of different SAC305 material models calibrated on isothermal tests using in-situ TMF measurement of thermally induced shear load
|
Kuczynska, M.
|
|
2018
|
|
P1 |
p. 67-85
|
article
|
Journal description